FLEX-IMX8M-MINI

FLEX-IMX8M-MINI

FLEX-IMX8M-MINI

Product catalog summary
Specifications Overview
  • Core System: Utilizes NXP i.MX8M Mini processors available in Solo, Dual, and Quad configurations with a speed of 1.8GHz, based on ARM Cortex-A53 and M4 architecture. It includes a ROHM BD71847 PMIC, supports up to 4GB LPDDR4 memory, and has a default eMMC storage of 16GB.
  • Connectivity: Features a 260-pin DDR4 SO-DIMM board-to-board connector, Atheros AR8035 Gigabit LAN, and Qualcomm QCA9377 for Wi-Fi (802.11 a/b/g/n/ac) and Bluetooth 5 connectivity. An optional MHF4 connector is available.
  • Signaling and Interfaces: Includes MIPI CSI and DSI, LAN, PCIe, USB (3.0 and 2.0/OTG), I2S, SDIO, UART, SPI, I2C, PWM, and GPIO interfaces.
  • Video and Audio: Equipped with Vivante GC Nano Ultra graphics engine, supports 1080p60 H.264 video decode and encode, and has a 2-channel I2S audio interface.
  • Power Specifications: Operates on 5V DC with a tolerance of +/-5%. Power consumption varies based on configuration.
  • Operating Systems: Compatible with Linux, Yocto, and Android.
Main Features
  • FLEX System-on-Modules: The TechNexion FLEX-IMX8M-MINI offers high performance and reliability, supporting 2D and 3D graphics and 1080p video quality for enhanced visual experiences. It provides flexible connectivity with high-speed interfaces.
Environmental and Mechanical Specifications
  • Dimensions: 69 x 35 mm, weighing 10 grams.
  • Temperature Range: Available in commercial (0° to +60° C), extended (-20° to +70° C), and industrial (-40° to +85° C) temperature ranges.
  • Durability: MTBF of over 100,000 hours, shock resistance of 50G/25ms, and vibration resistance of 20G/0-600Hz.
Certification and Compliance
  • Complies with FCC, IC, TELEC, EN standards, and RCM. It is also RoHS and REACH compliant.
See more

Catalog excerpts

FLEX-IMX8M-MINI-1

Main Features • TechNexion FLEX-IMX8M-MINI is a high-performance and reliability SoM featuring NXP i.MX8M Mini applications processor based on ARM Cortex-A53 and Cortex-M4 architecture that provides industry-leading computing performance, efficiency and security. • Featuring 2D and 3D graphics, 1080p video quality for rich visual HMI experience. • It supports the newest high-speed interfaces for flexible connectivity. Specifications Core System Processor Speed Architecture PMIC Memory Storage Board-to-Board Connector System on Module Connectivity Network LAN Wi-Fi/Bluetooth NXP i.MX8M Mini Solo NXP i.MX8M Mini Dual NXP i.MX8M Mini Quad 1.8GHz ARM Cortex-A53 + M4 ROHM BD71847 up to 4GB LPDDR4 eMMC (16GB Default) 260-pin DDR4 SO-DIMM FLEX SOM 1x Atheros AR8035 Gigabit LAN Qualcomm QCA9377 Video Graphic Engine Video Decode Video Encode Camera Audio Audio Codec Audio Interface Power Specifications Power Input Power Consumption Operation Systems Boot Sett Vivante GC Nano Ultra 1080p60 H.264 1080p60 H.264 MIPI CSI (4 lanes) On carrier board I2S (2 channel) 802-11 a/b/g/n/ac + BT 5 (br+edr+ble) Standard Support Linux MHF4 connector (optional) Yocto FLEX System-on-Modules

 Open the catalog to page 1
FLEX-IMX8M-MINI-2

FLEX-IMX8M-MINI Block Diagram Environmental and Mechanical Order Information Example: Dimensions Form Factor Weight Temperature Relative Humidity MTBF Shock Vibration 69 x 35 mm FLEX Compute Module 10 grams Commercial: 0° to +60° C Extended: -20° to +70° C Industrial: -40° to +85° C 10 to 90 % >100 000 Hours 50G/25ms 20G/0-600Hz Certification and Compliance USA Canada Japan European Union Australia/New Zealand Certification FCC ID: 2AKZA-QCA9377 IC: 22364-QCA9377 TELEC: 201-180629 EN 55032 / EN 55024 EN 300 328 v2.1.1 EN 301 893 v2.1.1 RCM Compliant with RoHS / REACH directives * Feel free to...

 Open the catalog to page 2
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.