Photoetching Capabilities Brochure
8Pages

Precision Engineered Parts www.tech-etch.com Photoetching ● Laser Cutting ● Forming ● Finishing Thin Metal Parts ● Flexible Circuits ● EMI Shielding Gaskets

Etched Edge Center to Center See Table 2 Hole Diameter Typical Etched Dimensions Tech-Etch specializes in the manufacture of light gauge metal parts. The photoetching process allows us to produce intricate metal components with close tolerances that are impossible to duplicate by other production methods. Tech-Etch is setting industry standards for the manufacture of encoders, masks, filters, lead frames, flat springs, strain gauges, laminations, chip carriers, step covers, heat sinks, shields, shutter blades, electron grids, fluidic circuit plates, reticles, drive bands, and shims....

Tech-Etch manufactures formed parts by combining photoetching, used for blanking, with inexpensive or universal tooling, used for forming. Select the etch and form manufacturing process for quick turn and low tooling cost. This method produces burr-free parts in intricate and complex designs and shapes. It also makes it possible to prove your design in preproduction quantities without having to commit to expensive, progressive die tooling. The following guidelines show practical methods to assure proper function and the best cost. HAND FORMING For bends that do not require structural...

SPECIAL PROCESSES LAMINATING & ETCHING POLYIMIDE FILM When a dielectric is required to maintain accurate finger spacing or for insulation, Tech-Etch can laminate materials such as polyimide. Polyimide can be die-cut and directly bonded in place or full sheet laminated and then photoetched for extremely accurate positioning. Parts can be formed after lamination of insulation. ASSEMBLY Tech-Etch's precision spot welding equipment is used to join small parts as well as accurately close cylinders and boxes. Soldering is an alternative. Various adhesives are also applied to join assembled...

FLEXIBLE CIRCUIT MANUFACTURING Tech-Etch specializes in manufacturing high reliability flexible circuits using both adhesive based and adhesiveless raw materials. By using an additive process, copper features and spaces as small as .0015" can be produced in production volumes. PLATED THROUGH VIAS This capability provides hole sizes down to .001" dia. for micro via and blind via multilayer circuits. Tech-Etch offers through, blind and buried vias in multilayer flex circuits. ASSEMBLY Tech-Etch is equipped for both through hole and SMT assembly of components on flex circuits. Package sizes...

.050" Thick Titanium Fuel Cell Flow Field Plate. Chem Milled. Dynamic Flexible Circuit (.0027" total Thickness) with a Large Polyimide Stiffener. Gold Plated. .020" Thick Titanium Implant Mesh. Photoetched. Single Layer Flexible Circuit with FR.4 Stiffeners and .010" Copper Fingers. .005" Thick Beryllium Copper Alloy 25 Encoder Disc. Photoetched Blank. .003" Thick Beryllium Copper Interconnection with Laminated Polyimide Support Strip. Photoetched Blank. Die Formed. Tin Lead Plated with Solder Dip. Board Level Shield. Photoetched Blank. Cover: .010" Thick FH Brass Die Formed. Fence: .015"...

.003" Thick Beryllium Copper RFI Shield. Photoetched Blank. Die Formed. Heat Treated. Gold Plated .032" Thick Brass Filter Support. Photoetched Blank. .012" Thick Beryllium Copper Contact Springs. Photoetched Blank. Die Formed. Heat Treated. Gold Plated. .093" Thick Stainless Steel Deflection Gauge. Photoetched Graphics. Laser Cut Blank. .003" Thick Beryllium Copper Interconnection with Laminated Polyimide Support Strip. Photoetched Blank. Die Formed. Tin Lead Plated with Solder Dip. .008" Thick Beryllium Copper RF Shield. Photoetched Blank. Die Formed. Heat Treated. Bright Tin Plated....

A TOTAL CAPABILITY Manufacturing Facilities Tech-Etch corporate headquarters is located in Plymouth, Massachusetts, just 40 minutes south of Boston. Using the latest etching, metal fabrication and metal finishing equipment, Tech-Etch specializes in photoetching, forming and laminating engineered components and flexible circuits. The Laser Machining Center provides the additional capability to cut thicker materials to precise specifications. In all, Tech-Etch has over 150,000 square feet of manufacturing and office space. Tech-Etch conforms to all local and EPA regulations, and waste...