• All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Multilayer Chip Beads For signal line MMZ/MMZ-E series Type: Issue date: MMZ0402 [01005 inch]* (STD) MMZ0603 [0201 inch] (STD) MMZ1005 [0402 inch] (STD) MMZ1005-E [0402 inch] (Wide band/High impedance type) MMZ1608 [0603 inch] (STD) MMZ2012 [0805 inch] (STD) * Dimensions Code JIS[EIA] May 2011
Open the catalog to page 1• All specifications are subject to change without notice. (1/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ0402 Type FEATURES • It is super small size(L0.4×W0.2×T0.2mm). • It prevents radiated noise from high-speed signal lines. • Maintain impedance to high frequency band. • Because it adopts silver in internal electrode, it is low DC resistance. • Because it is not generate of cross talk with closed magnetic circuit structural design, high density assembly is possible. • It is a product conforming to RoHS directive. APPLICATIONS Removal of signal line noises...
Open the catalog to page 2• All specifications are subject to change without notice. (3/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ0603 Type FEATURES • This is a multilayered chip bead product with dimensions of L0.6×W0.3×T0.3mm. • The product is magnetically shielded, allowing high density mounting. • We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz range. • It is a...
Open the catalog to page 4• All specifications are subject to change without notice. (7/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ1005 Type FEATURES • Size standardized for use by automatic assembly equipment. No preferred orientation. • Electroplated terminal electrodes accommodate reflow soldering. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low DC resistance structure of electrode prevents wasteful electric power consumption. • It is a product conforming...
Open the catalog to page 8• All specifications are subject to change without notice. (12/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ1005-E Type FEATURES • Compared with the existing MMZ1005 type, this new product has broad-band impedance values for higher frequency ranges. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Electroplated terminal electrodes accommodate reflow soldering. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between...
Open the catalog to page 13• All specifications are subject to change without notice. (15/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ1608 Type FEATURES • Chip bead(impeder), MMZ series offers 8 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low...
Open the catalog to page 16• All specifications are subject to change without notice. (23/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ2012 Type FEATURES • Chip bead(impeder), MMZ series offers 4 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low...
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