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Multilayer Chip Beads

Multilayer Chip Beads
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Multilayer Chip Beads

Product catalog summary
Overview: The document outlines the technical specifications and guidelines for the MMZ series of multilayer chip beads, which are designed for signal line noise removal in electronic devices. It covers various models such as MMZ0402, MMZ0603, and MMZ1005, detailing their features, applications, and handling precautions.
Specifications: The MMZ chip beads comply with the RoHS Directive, ensuring they are free from hazardous substances. They are available in multiple sizes and impedance values, suitable for high-frequency applications. The document specifies dimensions, material codes, and packaging styles for each type.
Features: These chip beads are designed to prevent radiated noise and maintain impedance at high frequencies. They feature a closed magnetic circuit design for high-density assembly, low DC resistance, and high reliability.
Applications: The components are used in electronic devices such as cellular phones, portable audio players, PCs, TVs, and game machines to eliminate signal line noises.
Handling and Precautions: Recommendations include preheating components before soldering, avoiding stress on mounted components, and preventing exposure to stray magnetic fields. Guidelines for static electricity discharge and hand soldering are also provided.
Material Characteristics: Various materials (B, S, Y, D, F) are used, each offering unique impedance characteristics suitable for different frequency ranges and applications.
Electrical Characteristics: Detailed electrical characteristics, such as impedance and DC resistance, are provided for various part numbers. Recommended soldering conditions and temperature ranges for operation and storage are included.
Packaging and Dimensions: The chip beads are available in taping packaging with specified quantities per reel. Detailed dimensions and recommended PC board patterns for each type are included.
Conclusion: The MMZ series chip beads are versatile components designed for effective noise suppression in electronic devices, focusing on high-frequency performance and environmental compliance.
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Catalog excerpts

Multilayer Chip Beads-1

• All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Multilayer Chip Beads For signal line MMZ/MMZ-E series Type: Issue date: MMZ0402 [01005 inch]* (STD) MMZ0603 [0201 inch] (STD) MMZ1005 [0402 inch] (STD) MMZ1005-E [0402 inch] (Wide band/High impedance type) MMZ1608 [0603 inch] (STD) MMZ2012 [0805 inch] (STD) * Dimensions Code JIS[EIA] May 2011

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Multilayer Chip Beads-2

• All specifications are subject to change without notice. (1/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ0402 Type FEATURES • It is super small size(L0.4×W0.2×T0.2mm). • It prevents radiated noise from high-speed signal lines. • Maintain impedance to high frequency band. • Because it adopts silver in internal electrode, it is low DC resistance. • Because it is not generate of cross talk with closed magnetic circuit structural design, high density assembly is possible. • It is a product conforming to RoHS directive. APPLICATIONS Removal of signal line noises...

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Multilayer Chip Beads-4

• All specifications are subject to change without notice. (3/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ0603 Type FEATURES • This is a multilayered chip bead product with dimensions of L0.6×W0.3×T0.3mm. • The product is magnetically shielded, allowing high density mounting. • We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz range. • It is a...

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Multilayer Chip Beads-8

• All specifications are subject to change without notice. (7/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ1005 Type FEATURES • Size standardized for use by automatic assembly equipment. No preferred orientation. • Electroplated terminal electrodes accommodate reflow soldering. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low DC resistance structure of electrode prevents wasteful electric power consumption. • It is a product conforming...

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Multilayer Chip Beads-13

• All specifications are subject to change without notice. (12/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ1005-E Type FEATURES • Compared with the existing MMZ1005 type, this new product has broad-band impedance values for higher frequency ranges. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Electroplated terminal electrodes accommodate reflow soldering. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between...

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Multilayer Chip Beads-16

• All specifications are subject to change without notice. (15/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ1608 Type FEATURES • Chip bead(impeder), MMZ series offers 8 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low...

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Multilayer Chip Beads-24

• All specifications are subject to change without notice. (23/26) 001-03 / 20110509 / e9412_mmz Chip Beads(SMD) For Signal Line MMZ Series MMZ2012 Type FEATURES • Chip bead(impeder), MMZ series offers 4 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low...

 Open the catalog to page 24

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