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Flip Chip Bonder

Product catalog summary

Specifications and Key Features
The AFM-15 Flip Chip Bonder is designed for high precision, cost-sensitive applications, offering an all-in-one process for mounting and bonding. It features high-speed and accuracy with a mounting speed of 0.8 seconds per IC chip component and an accuracy of +/- 8µm. The machine has a compact footprint of 1.7 square meters and is user-friendly with a color touch screen interface. It supports inspection of known good die from wafers and can handle materials such as FR4, ceramic, or silicon without the need for cleaning or lead processes.

Bonding Process and Product Compatibility
The AFM-15 utilizes ultrasonic gold-to-gold interconnection, suitable for products like TCXO, SAW, OPTO modules, and high-frequency components. It supports IC dimensions ranging from 0.3W x 0.3D x 0.1T mm to 5.0W x 5.0D x 1.0T mm and board dimensions from 50W x 50D x 0.3T mm to 180W x 120D x 3.2T mm.

Performance and Capacity
The cycle time is 0.8 seconds per IC, excluding bonding process time, with a nozzle positioning accuracy of ±8µm/3σ. The maximum load capacity is 20N, with a special option for 100N. The machine can supply ICs from 5/6 inch wafers, with an 8-inch option available.

Machine Specifications
The AFM-15 measures 1,200W x 1,450D x 1,550H mm and weighs 2,000 kg. Standard features include a pre/mounting heater table, nozzle auto cleaning and monitoring, US checking, IC height measurement, bump detection, and production management data capabilities.

Options and Additional Features
Optional features include a magazine loader/unloader, special ionizer, carrier handling, plasma cleaning unit, and factory automation technology. The machine also supports high accuracy mode and various dispensing features.

Catalog excerpts

Specifications AFM-15AFM-22MDM-20Bonding Process Gold-to-gold interconnectionHeat compressionGlue dispensing(ultra sonic)(NCP, ACP, NCF, ACF, C4 and etc) Products TCXO, SAW, OPTO,Module, OPTO and etcAll of left productsHigh Frequency and etc IC MAX: 5.0W x 5.0D x 1.0T mmMAX: 30W x 30D x 0.635T mmΖMIN: 0.3W x 0.3D x 0.1T mmMIN: 3W x 3D x 0.25T mm Board MAX: 180W x 120D x 3.2T mmMAX: 180W x 120D x 1.6T mmMAX: 200W x 150D x 2.0T mmMIN: 50W x 50D x 0.3T mmMIN: 50W x 50D x 0.4T mmMIN: 30W x 30D x 0.3T mm Cycle Time 0.8sec/IC5.0sec/IC֖(excluding bonding process time)(excluding bonding process time) Accuracy 8 ѵ m/3 σ 3 ѵ m/3 σ 10 ѵ m(nozzle positioning accuracy) MAX Load 20N (special 100N) 372.4N IC Supply 5/6 inch wafer (8 inch option)2inch tray and etc֖ θ axis correctionHot blow Production management data Machine size Option and 1,200W x 1,450D x 1,550H mm 750W x 910D x 1,760H mm 740W x 1,140D x 1,550H mm Magazine Loader/UnloaderMagazine Loader/UnloaderMagazine Loader/Unloader Machine weight Special Features 2,000kg 1,100kg 680 kg IonizerIonizerPost heater table Carrier handling3.4inch trayCarrier handlingHepa-filter6inch waferDispensing monitoring Plasma cleaning unitLow pressure capability (min: 10g)Sylinge temperature adjustment Load/US sampling Nozzle surface monitoring 8 inch wafer Map data High accuracy mode Standard Features Pre/Mounting heater tableMounting heater tableVarious dispensing featuresNozzle auto cleaning & monitoringHepa-filterNozzle auto cleaning US checkingParallelism verificationPre/Dispense heater table IC height measurementBonding position verificationHeight detection Bump detectionTemperature calibrationProduction management data Wafer expandProduction management data Wafer > ? For High Precision Cost-Sensitive Applications All in one process for mounting and bonding? High Speed and Accuracy Mounting m? Small Footprint: Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8 1.7 Square Meters? Easy Operation with Color Touch Screen? Inspection of Known Good Die from wafer? Capable to handle FR4, Ceramic or Silicon No CleanNo Lead Process >

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