TFL-204-111M
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Lead-free Solder Paste TLF-204-111M LFSOLDER TLF-204-111M is Pb-free solder paste using Pb-free, spherical solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux without washing. ■ Reduced area of voiding ■ Reduction of chip side ball ■ Reduced slump in preheating stage ■ Improvement of solderability of microscopic sized lands ■ Excellent heat resistance for higher temperature preheating TAMURA ELSOLD GmbH HiittenstraBe 1 ■ D-38871 llsenburg Phone +49 (0)39452 4879-11 ■ Fax: -66 info@tamura-elsold.de

Lead-free Solder Paste TLF-204-111M Printability & Solderability Circuit board for evaluation: Metal mask thickness: Metal mask opening: Printing speed: Snap off speed: Evaluation by the 10th sheets provides superior Improvement of the solderability of microscopic sized lands by ensuring the stable printability. TLF-204-111 f solderability even at the peak temperature of 225 °C. Conventional product of our company Product 1 Company A Product 2 Company A Reflow conditions preheating temperature: 150°C TAMURA ELSOLD GmbH HuttenstraBe 1 ■ D-38871 llsenburg Phone +49 (0)39452 4879-11 ■ Fax: -66...

Lead-free Solder Paste TLF-204-111M Chip Side Balls Reducing chip side balls by stopping the flow of flux residue and stopping capillary flow. Also, the slump during pre-heating has been reduced. 1: TLF-204-111M 2: Conventional product of our company 3: Product 1 Company A 4: Product 2 Company A Chip Side Ball 110% metal mask opening Printing environment : 23°C,35%RH 6 12 Printing time(h) Characteristics of Solder Paste nferiorl <5 Superior Circuit board: slump tendency test board 0.2 mm gap Metal mask thickness: 120 pm Heating: Reflow condition 200 °C, 90 s Viscosity reliability at the...

Lead-free Solder Paste TLF-204-111M Cautions for Use ■ Stirring of Solder Paste In the Case of Manual Stirring Thoroughly stir solder paste stored in refrigerators with spatula or the like after returning to room temperature without fail (It takes about three, four hours if left standing at 25). If the seal is broken the paste will absorb moisture to cause solder balls. In the Case of Using Automatic Stirring Apparatus An automatic stirring apparatus is utilized at times to use solder paste stored in refrigerators by returning it to room temperature in a short period of time. Even if such...

Reflow Conditions Temperature profile of air reflow ■ Preheat Set the temperature rising speed A at a rate of 2 to 4 °C/s. Careful about rapid temperature rise in preheat zone as it may cause excessive slumping of the solder paste. Appropriate preheat time B will be from 60 to 120 seconds. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if performed excessively, fine balls and large balls will generate in clusters at a time, ppropriate preheat ending temperature C will be from 180 to 200 °C. If the temperature is too low, non-melting tends to be...