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SM-388 SACBI-189

SM-388 SACBI-189

SM-388 SACBI-189

Product catalog summary

Typical Reflow Profile for SnAg3Cu0.5/Bi58Sn42

This document provides a typical reflow soldering temperature profile specifically for the SnAg3Cu0.5/Bi58Sn42 solder alloy system. The profile outlines the recommended temperature stages and parameters to ensure optimal solder joint quality and reliability.

Main Sections and Key Points

  • Specifications: The profile is designed for the SnAg3Cu0.5 (Tin-Silver-Copper) and Bi58Sn42 (Bismuth-Tin) solder alloys, which are commonly used in electronic assembly.
  • Temperature Parameters: The profile includes critical temperature points such as preheat, soak, reflow peak temperature, and cooling rates. These parameters are essential to avoid thermal damage and ensure proper solder melting and wetting.
  • Procedures: The reflow process involves controlled heating stages to gradually raise the temperature, maintain it within a specified range for solder melting, and then controlled cooling to solidify the solder joints.
  • Recommendations and Best Practices: The profile emphasizes maintaining temperature uniformity across the PCB, avoiding excessive peak temperatures to prevent component damage, and ensuring adequate time above liquidus for proper solder joint formation.

Summary of Critical Parameters

  • Preheat temperature ramp-up rate: Controlled to prevent thermal shock.
  • Soak zone temperature and duration: To activate flux and stabilize temperature.
  • Peak reflow temperature: Optimized for SnAg3Cu0.5/Bi58Sn42 melting points.
  • Time above liquidus (TAL): Sufficient to ensure complete solder joint formation without degrading components.
  • Cooling rate: Controlled to avoid thermal stress and ensure joint integrity.

This reflow profile serves as a guideline for manufacturing processes using these solder alloys, aiming to maximize solder joint reliability and minimize defects.

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Catalog excerpts

SM-388 SACBI-189-1

The lead-free no clean solder paste SM-388 SACBI-189 is based on an established flux for lead-free solders with high temperature resistant synthetic resins. Residuals are brighter and clearer compared to common solder pastes. SM-388 SACBI-189 fulfills the requirements of class RELO of standards J-STD-004, J-STD-005 and DIN EN 61190-1-1. The used no clean flux contains additives as high boiling solvents, corrosion inhibitors, thixotropic agents and temperature resistant resins. These additives give the paste rheological properties adequate for SMT applications. Residuals of the solder solder paste SM-388 SACBI-189 are neither corrosive nor electrically conductive. They are nearly colorless and usable in no clean processes. Due to the composition of the flux they are more resistant against humidity and water, which prevents the formation of typical white powder residuals e.g. after cleaning with water. ■ High activity on all substrates, incl. OSP ■ High printing speed up to 150 mm/s ■ Stable wetting behavior over a wide range of profiles ■ Stencil life of up to 8 h under proper process parameters ■ Low reflow-profile with low maximum temperatures of 210-220 °C ■ Very good tack time of up to 16 h ■ J-STD-004 Flux classification: RELO Very good printing characteristics to 0.4 mm pitch with type 3 powder ■ Very good slump characteristics Physical Properties Data given for Sn96.5Ag3Cu0.5/Bi58Sn42, metal 87 %, 25-45 pm Viscosity (Brookfield): 600 - 700 Pa s IPC-TM-650 2.4.34 This Special Solder Paste is suitable for applications, which do not permit typically high reflow-temperatures of up to 240 °C. TAMURAELSOLD GmbH HuttenstraKe 1 ■ D-38871 llsenburg Phone +49 (0)39452 4879-11 ■ Fax: -66 [email protected]

 Open the catalog to page 1
SM-388 SACBI-189-2

Solder paste SM-388 SACBI-189 melts already at peak temperatures of 210 - 220 °C and can be applied by dispending, stencil or screen printing. Powder type Melting range Metal content for Metal content for screen/stencil printing dispensing Mixture of SnAg3Cu0.5 / Bi58Sn42 Cleaning SM-388SACBI-189 solder paste is a no clean formula. The residues do not need to be removed. If cleaning is desired anyhow, automated cleaning with a variety of commercially available agents is recommended. Packaging Syringes: 10 ccm (35 g) and 30 ccm (100 g) Cassettes: DEK Pro-Flow™ Cassette 750 g Jars/Cartridges: Syringes:...

 Open the catalog to page 2
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