SM-388 SACBI-189
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The lead-free no clean solder paste SM-388 SACBI-189 is based on an established flux for lead-free solders with high temperature resistant synthetic resins. Residuals are brighter and clearer compared to common solder pastes. SM-388 SACBI-189 fulfills the requirements of class RELO of standards J-STD-004, J-STD-005 and DIN EN 61190-1-1. The used no clean flux contains additives as high boiling solvents, corrosion inhibitors, thixotropic agents and temperature resistant resins. These additives give the paste rheological properties adequate for SMT applications. Residuals of the solder solder paste SM-388 SACBI-189 are neither corrosive nor electrically conductive. They are nearly colorless and usable in no clean processes. Due to the composition of the flux they are more resistant against humidity and water, which prevents the formation of typical white powder residuals e.g. after cleaning with water. ■ High activity on all substrates, incl. OSP ■ High printing speed up to 150 mm/s ■ Stable wetting behavior over a wide range of profiles ■ Stencil life of up to 8 h under proper process parameters ■ Low reflow-profile with low maximum temperatures of 210-220 °C ■ Very good tack time of up to 16 h ■ J-STD-004 Flux classification: RELO Very good printing characteristics to 0.4 mm pitch with type 3 powder ■ Very good slump characteristics Physical Properties Data given for Sn96.5Ag3Cu0.5/Bi58Sn42, metal 87 %, 25-45 pm Viscosity (Brookfield): 600 - 700 Pa s IPC-TM-650 2.4.34 This Special Solder Paste is suitable for applications, which do not permit typically high reflow-temperatures of up to 240 °C. TAMURAELSOLD GmbH HuttenstraKe 1 ■ D-38871 llsenburg Phone +49 (0)39452 4879-11 ■ Fax: -66 info@tamura-elsold.de

Solder paste SM-388 SACBI-189 melts already at peak temperatures of 210 - 220 °C and can be applied by dispending, stencil or screen printing. Powder type Melting range Metal content for Metal content for screen/stencil printing dispensing Mixture of SnAg3Cu0.5 / Bi58Sn42 Cleaning SM-388SACBI-189 solder paste is a no clean formula. The residues do not need to be removed. If cleaning is desired anyhow, automated cleaning with a variety of commercially available agents is recommended. Packaging Syringes: 10 ccm (35 g) and 30 ccm (100 g) Cassettes: DEK Pro-Flow™ Cassette 750 g Jars/Cartridges:...