Lead-free Alloys for Wave and Dip Soldering Process
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Lead-free Alloys for Wave and Dip Soldering Process Lead-free ELSOLD alloys are particularly suited as replacement for conventional lead-bearing alloys having been used up to now for wave and dip soldering. Due to the purity of the raw materials used impurity levels of the finished products are much lower than the limits admitted by the relevant norms. This leads to longer useful life of the solder bath and to a marked reduction in dross formation. Due to their special manufacturing process ELSOLD lead-free solder alloys substantially reduce solder defects like bridges and icicles when compared to competitive products. This results in less rework and thus leads to a higher productivity in the printed circuit board assembly. ELSOLD Lead-free alloys are available in 3 groups: Tin-Silver Alloys: ELSOLD SA Melting point/ range [°C] Tin-Copper Alloys: ELSOLD SC Melting point/ range [°C] Tin-Silver-Copper Alloys: ELSOLD SAC Melting point/ range [°C] Other Lead-free Alloys available on request. Alloys meet and exceed the requirements of relevant standards (DIN EN) ISO 9453, DIN EN 61190-1-3, ELSOLD House norms. Typical impurity levels are well below limits of common standards. TAMURA ELSOLD GmbH www.tamura-elsold.de HuttenstraKe 1 ■ D-38871 llsenburg Phone +49 (0)39452 4879-11 ■ Fax: -66 info@tamura-elsold.de

Lead-free Alloys for Wave and Dip Soldering Process Forms of Delivery Standard Dimensions [mm] Weight/unit Solder bars with suspension eyelet 50 (W) x 18 (H) x 600 (L) 50 (W) x 20 (H) x 490 (L) approx. 4.3 kg approx. 3.7 kg Triangular bars 8 (W) x 10 (H) x 400 (L) Bundles of 25 kg Clippings 8 (W) x 10 (H) x 30 (L) Bulk material 1 Kg bars 20 (W) x 20 (H) x 335 (L) approx. 1 kg More designs available including wires, threads, rods, etc. Impurities of Lead-free Solder Alloys Element Maximum per (DIN EN) ISO 9453 [%] Typical level as supplied by TEG [%] Level for replenishing or replacement...

Typical level as supplied by TEG [%] Level for replenishing or replacement (recommended) [%] Critical level [%] Possibly negative effect on solder spread. Arsenic can have a negative impact on wettability from Grainy appearance of the solder surface is possible from Fe concentrations of 0.03 % and more. In low concentration levels Bi has a positive influence on solderability and fatigue behaviour. In the transition phase to lead-free alloys, however, care has to be taken since even small concentrations in the solder may lead to low-melting phases. Even small concentrations can increase the...

Lead-free Alloys for Wave and Dip Soldering Process ELFLUX offers a wide range of Fluxes for the optimization of your soldering process. For details please review the relevant product data sheets. Shelf Life Materials can be stored for a minimum of 5 years in a clean, cool and dry environment. Marking TAMURA ELSOLD Lead-free bars are marked with the ELSOLD Smiley in order to avoid mixing with lead-bearing material. Service TAMURA ELSOLD offers analytical service for your solder pot. Within 48 hours at the latest our laboratory will advise customers of the exact composition and impurity...