Lead-bearing Dip Solder Paste Sn63Pb37
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Lead-bearing Dip Solder Paste Sn63Pb37 Product Description TAMURA ELSOLD Dip Paste is a mildly activated lead-bearing solder paste designed for dip application. BGA's and components with Gull Wing leads or similar can be easily charged with solder paste and flux by predefined dipping process. Compared to dispensing dipping is much faster and safes production time. Moreover likelihood of bridging is clearly reduced due to less applied solder paste and solder. By adding solder probability for cold joints caused by uneven substrates is strongly reduced. Depth of immersion is determined by geometrical shape of connections. Component bodies must not come into contact with the dip paste. ELSOLD Dip Paste provides ■ Good tackiness ■ Flux classification J-STD-004: R0L1 ■ Suitable for all soldering methods with indirect heating Very good wetting on most surfaces Optimal application control High activity on all substrates Long open time High slump resistance Test Results Tack Time > 8 h Solder-Ball-Test: pass IPC-TM 650, Method 2.4.43 Copper-Mirror-Test: L IPC-TM-650, Method 2.3.3 Silver-Chromate-Paper-Test: pass IPC-TM-650, Method 2.3.35.1 Surface Insulation Resistance J-STD-0004, IPC-TM-650, Method 2.6.3.3 Uncleaned, after 24 h Uncleaned, after 96 h Uncleaned, after 168 h Control, after 24 h: Control, after 96 h: Control, after 168 h: TAMURA ELSOLD GmbH www.tamura-elsold.de HuttenstraKe 1 ■ D-38871 llsenburg Phone +49 (0)39452 4879-11 ■ Fax: -66 info@tamura-elsold.de

Physical Properties Data for Sn63Pb37,70 % Metal, Powder type 5:10 - 25 pm: Viscosity: 250 - 350 Pa-s Melting temperature: 183 °C Application TAMURA ELSOLD Dip Solder Paste is applied by dipping connections into the paste. Immersion depth can be defined by stencil printing using a stencil of the appropriate thickness or by programming immersion depth with an automatic repair system. Dip Paste contains very fine solder powder. Therefore solder paste should be allowed to reach room temperature before opening containers to avoid condensation of moisture on the cold material. After use...