Lead-free Solder Paste AP-40 With AP-40 excellent soldering results can be achieved on all normal surfaces and with different component surface finishes. Solder balling, wetting, and slump resistance test results exceed customer requirements. Measurements: n*), climate 40 °C/93 % RH; 168 hrs; 5 V DC, track width 400 pm, gap 200 pm Electro-migration: no dendrites climate: 40 °C/93 % RH.; 168 hrs; 5 V DC. Physical Properties All data apply to Sn96.5Ag3Cu0.5, metal content of 89 %, grain size 25 - 45 pm Viscosity: 650 ± 100 Pa s (Plate-plate viscosimeter) *) smallest value measured during the test duration of 168 hrs. TAMURA ELSOLD GmbH www.tamura-elsold.de HuttenstraKe 1 ■ D-38871 llsenburg Phone +49 (0)39452 4879-11 ■ Fax: -66 [email protected]

Lead-free Solder Paste AP-40 Classification ELSOLD solder paste AP-40 is completely free from halides and halogens and classified as RELO per J-STD-004 or DIN EN 61190-1-1. Application The solder paste can be used by dispensing, stencil printing or screen printing. In general we recommend the following metal content ratios for the respective processes: Powder Type Meting Range Metal Content for Stencil or Screen Printing Metal Content For Dispensing Solder Paste AP-40 is also available with micro-alloyed solder powder Sn96.5Ag3Cu0.5 MA in T4! Cleaning TAMURA ELSOLD solder paste AP-40 is a no...

Lead-free Solder Paste AP-40 Stainless steel 25- 150 mm/s 150-300 g/cm length Stainless steel Print Parameters Squeegee: Squeegee speed: Squeegee pressure Stencil: Reflow Profile for Sn96.5Ag3Cu0.5 TAMURA ELSOLD solder paste AP-40 yields good results for a wide range of temperature profiles. A linear profile is recommended as the starting point for further process optimisation. Typical Profile AP-40 / Sn96.5Ag3Cu0.5 RoHS Conformity ELSOLD solder pastes AP-40 comply with RoHS Directive 2002/95/EC. Norms The paste meets the requirements of international norms J-STD-005 and DIN EN 61190-1 -2, as...