AP-40 Sn63Pb37
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Besides these special benefits TAMURA ELSOLD solder paste AP-40 has a wide process window, both under air as well as under nitrogen, meeting the diverse requirements of different PCB configurations. While a linear profile will guarantee best results, soak profiles have in many cases yielded excellent results as well. With AP-40 excellent soldering results can be achieved on all normal surfaces and with different component surface finishes. Solder balling, wetting, and slump resistance test results exceed customer requirements. Physical Properties All data apply to Sn62Pb36Ag2 T3, metal content of 90 %, grain size 25 - 45 pm Viscosity: 700 +100 Pa s (Plate-plate viscosimeter) Reliability Properties Copper mirror Test: Pass J-STD-004, IPC-TM-650, Method 2.3.32 Silver chromate Test: Pass J-STD-004, IPC-TM-650, Method 2.3.33 Solder Balling Test: Pass J-STD-005, IPC-TM-650, Method 2.4.34 SIR Measurements: 1.9 x 109 O; climate 40 °C / 93 % RH; 168 hrs; 5 V DC, track width 400 pm, gap 200 pm Electro-migration: no dendrites climate: 40 °C/93 % RH.; 168 hrs; 5 V DC. *) smallest value measured during the test duration of 168 hrs. TAMURA ELSOLD GmbH www.tamura-elsold.de HuttenstraKe 1 ■ D-38871 llsenburg Phone +49 (0)39452 4879-11 ■ Fax: -66 info@tamura-elsold.de

Classification TAMURA ELSOLD solder paste AP-40 is completely free from halides and halogens and classified as RELO per J-STD-004 or DIN EN 61190-1-1. Application The solder paste can be used by dispensing, stencil printing or screen printing. In general we recommend the following metal content ratios for the respective processes: Powder Type Melting point Metal content for Stencil/Sieve printing Metal Content for Dispensing Cleaning TAMURA ELSOLD solder paste AP-40 is a no clean paste and leaves only very few, light, slightly milky residues which can remain on the solder joint without...

Stainless steel 25- 150 mm/s 150-300 g/cm length Stainless steel Print Parameters Squeegee: Squeegee speed: Squeegee pressure Stencil: Reflow Profile for Sn62Pb36Ag2 and Sn63Pb37 TAMURA ELSOLD solder paste AP-40 yields good results for a wide range of temperature profiles. A linear profile is recommended as the starting point for further process optimisation. RoHS Conformity ELSOLD solder pastes AP-40 Sn63Pb37 and Sn62Pb36Ag2 contain lead. Norms The paste meets the requirements of international norms J-STD-005 and DIN EN 61190-1 -2, as well as DIN 32513-1 The information contained herein is...