Ap-20
3Pages

ELSOLD Lead-free Solder Paste AP-20 Product Description Due to its special and fully halide-free recipe and the use of high-quality materials, lead-free solder paste AP-20 offers the user many advantages while satisfying at the same time all requirements regarding the reliability of lead-free solder joints. The unique properties of the used materials allow the user to process boards even 10 hours and more after printing without losing any of the original tackiness of the printed solder deposit. This facilitates in many cases flexible planning and implementation of the individual process steps of printed circuit board assembly. The use of chemically modified materials results in a very high reproducibility of the solder paste. For the user this means constant printing results from board to board. Interruptions and defects in the printing process are minimised and the throughput is increased considerably in comparison to conventional pastes. Measurements over longer periods have shown that under suitable storage conditions the viscosity remains practically unchanged. As a result, solder paste AP-20 can be stored for 6 months (maintaining the recommended temperature ranges) without any deterioration of the excellent processing properties of the paste (good rolling on the stencil, slump resistance, tackiness). So even smaller and medium-sized operations will be able to enjoy the benefits of procuring economically attractive solder paste quantities. ELSOLD solder paste AP-20 is well suited for fine-pitch applications. Optimised production processes and high-grade materials guarantee unequalled slump resistance. No slumping of the printed solder paste deposits has been observed and - as a consequence - no bridging or solder balling after reflow. The solder paste deposits show very constant shapes and profiles, from print to print, from shift to shift (DIN 32513, 150 mm stencil, smallest gap 0.2 mm, at room temperature and 5 min at 150°C). Besides these special benefits ELSOLD solder paste AP-20 has a wide process window, both under air as well as under nitrogen, meeting the diverse requirements of different PCB configurations. While a linear profile will guarantee best results, soak profiles have in many cases yielded excellent results as well. With AP-20 excellent soldering results can be achieved on all normal surfaces and with different component surface finishes. Solder balling, wetting, and slump resistance test results exceed customer requirements. Approvals ELSOLD solder paste AP-20 has been recommended by Siemens Corporate Technology Lab, Berlin, for further evaluation under production conditions. The test certificate is available upon request. Classification ELSOLD solder paste AP-20 is completely free from halides and halogens and classified as BELO per J-STD-004 or DIN EN 61190-1-1. TAMURA ELSOLD GmbH www.tamura-elsold.de HuttenstraKe 1 ■ D-38871 llsenburg Fon +49 (0)39452 4879-0 ■ Fax: -66 info@tamura-elsold.de

Technical Product Information ELSOLD Lead-free Solder Paste AP-20 Physical Properties All data apply to Sn96.5Ag3Cu0.5, 89 % Metal content, grain size 25 - 45 pm Viscosity 650 + 50 Pa s (Plate Viscosimeter) *) smallest value measured during the test duration of 168 hrs Application The solder paste can be used by dispensing, stencil printing or screen printing. In general we recommend the following metal content ratios for the respective processes: Powder Type Melting Point /Range Metal Content for Printing Metal Content for Dispensing Solder paste AP-20 is also available with micro-alloyed...

ELSOLD Lead-free Solder Paste AP-20 Storage and Shelf Life Store in un-opened original containers under dry condition at 20 ± 5 °C. The material should be allowed to reach room temperature by itself before opening containers to avoid condensation of moisture on the cold material. Stainless steel 25- 150 mm/s 150 — 300 g / cm length Stainless steel Print Parameters Squeegee: Squeegee speed: Squeegee pressure: Stencil: Reflow Profile for Sn96.5Ag3Cu0.5 ELSOLD solder paste AP-20 yields good results for a wide range of temperature profiles. A linear profile is recommended as the starting point...