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Multilayer Chip Inductors for High Frequency HK series

Multilayer Chip Inductors for High Frequency HK series
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Multilayer Chip Inductors for High Frequency HK series

Product catalog summary
Notice for TAIYO YUDEN Products

Reminders:
  • Product information is subject to change; verify the latest details before use.
  • Taiyo Yuden is not liable for defects under unspecified conditions.
  • Contact Taiyo Yuden for detailed specifications and validate products in actual conditions before shipment.
  • Products are for general electronics; consult Taiyo Yuden for critical applications.
  • Not suitable for aerospace, aviation, nuclear, or military applications.
  • Ensure protective circuits for high safety or reliability needs.
  • Products must be purchased from official sales channels.
  • Export may require specific procedures.

Features:
  • Multilayer inductors with advanced ceramics and low-resistivity silver for high Q and SRF characteristics.
  • Designed for applications above 100MHz, suitable for portable phones, WLAN, and high-frequency circuits.

Ordering Code and Specifications:
  • Type: HK - Multilayer chip inductors for high frequency.
  • Various sizes available with nominal inductance from 1.0nH to 470.0nH.
  • Inductance tolerances include H (±3%), J (±5%), C (±0.2nH), S (±0.3nH).
  • Packaging: Tape & Reel.

Applications:
  • High-frequency circuits and EMI countermeasures.

Part Numbers:
  • Includes specifications like inductance, Q factor, SRF, DC resistance, and rated current.
Specifications and Measurement:
1. Measuring Frequency and Equipment: Different series have specific measuring frequencies and equipment, such as 1MHz for CKP and NM series, and up to 500MHz for HKQ series.
2. Measuring Current: Varies with inductance, e.g., 1mA rms for 0.047 to 4.7μH.

Reliability Data:
1. DC Resistance: Lists maximum resistance values for various series.
2. Self Resonance Frequency (SRF): Provides minimum SRF values.
3. Temperature Characteristics: Inductance change within ±10% for HK series from -30 to +85°C.

Test Methods and Remarks:
1. Resistance to Flexure: No mechanical damage under specified conditions.
2. Solderability: At least 75% of the terminal electrode must be covered by new solder.
3. Resistance to Soldering: Tests include specific solder temperatures and recovery conditions.
4. Thermal Shock: Involves cycles of minimum and maximum temperatures.
5. Damp Heat (Steady State): Conducted at 40±2°C and 90 to 95% RH for 500 hours.
6. Loading under Damp Heat: Similar conditions with applied current.
7. Loading at High Temperature: Conducted at specified temperatures for different series.

Precautions:
1. Circuit Design: Verify operating environments and electrical ratings, especially for critical applications.
Operating Current
1. Ensure operating current is below rated values to prevent reduced inductance.

PCB Design Precautions
Pattern Configurations
1. Proper design of land patterns is crucial to withstand mechanical stresses.
2. Separate soldering points with solder-resist when sharing a pad.

Inductor Layout on Panelized PC Boards
1. Plan configurations to minimize stress during manufacturing.

Technical Considerations
Design of Land-patterns
1. Recommended land dimensions are provided to prevent excessive solder amounts.

Considerations for Automatic Placement
Adjustment of Mounting Machine
1. Avoid excessive impact load during mounting.
2. Regular maintenance of the mounter is necessary.

Selection of Adhesives
1. Consult adhesive manufacturers to avoid degraded characteristics.

Soldering Precautions
Selection of Flux
1. Use flux with ≤0.1 wt% halogenated content.
2. Control the amount of flux applied.

Soldering
1. Follow recommended temperature profiles to prevent thermal shock.

Cleaning Precautions
Cleaning Conditions
1. Select cleaning solutions based on flux type and purpose.
Technical Considerations
  • Cleaning Conditions: Inappropriate solutions can degrade electrical properties. Recommended ultrasonic conditions include output below 20W/ℓ.
  • Post-Cleaning Processes: Resin coatings can release gases that deteriorate performance.
Handling Precautions
  • PC Board Separation: Avoid manual separation to prevent stress.
  • General Handling: Use static control bands and non-magnetic tweezers.
  • Mechanical Considerations: Avoid excessive mechanical shocks.
Storage Conditions
  • Storage Precautions: Maintain low temperature and humidity. Use within 6 months to prevent solderability issues.
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Catalog excerpts

Multilayer Chip Inductors for High Frequency HK series-1

11 notice_e-01 Notice for TAIYO YUDEN products@ Please read this notice before using the TAIYO YUDEN products. REMINDERS ¡ Product information in this catalog is as of October 2010. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. ¡ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. ¡ Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. ¡ All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. ¡ The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called “TAIYO YUDEN’s official sales channel”). It is only applicable to the products purchased from any of TAIYO YUDEN’ s official sales channel. ¡ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. ¡ Caution for export Certain items in this catalog may require specific procedures for export according to “Foreign Exchange and Foreign Trade Control Law” of Japan, “U.S. Export Administration Regulations”, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff.

 Open the catalog to page 1
Multilayer Chip Inductors for High Frequency HK series-5

11 77 FERRITE PRODUCTS mlci04_e-01 ¡ ELECTRICAL CHARACTERISTICS – This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. HK0603 0.01 0.1 1 10 6.8nH 10nH 47nH 22nH ¡Q-Characteristics Measured by HP8719C HK0603 10 10 10 2 4 6 10 0 0.01 0.1 1 10 47nH 22nH10nH 6.8nH ¡Impedance-vs-Frequency characteristics Measured by HP8719C...

 Open the catalog to page 5
Multilayer Chip Inductors for High Frequency HK series-9

mlci0109_reli_e-01 11 mlci0109_reli-PRP4 ¡ RELIABILITY DATA – This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 3. Rated Current BK0402 240`540mA DC BK0603 100`500mA ‚c‚b BK1005 120`1000mA ‚c‚b BK1608 150`1500mA ‚c‚b BK2125 200`1200mA ‚c‚b ARRAY BK2010 100mA ‚c‚b BK3216 100`200mA...

 Open the catalog to page 9
Multilayer Chip Inductors for High Frequency HK series-10

mlci0109_reli-PRP5 11 mlci0109_reli_e-01 ¡ RELIABILITY DATA – This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 5. Inductance BK0402 —— BK0603 BK1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 4.7`10.0ìHF}20% CK2125 0.1`10.0ìHF}20% CKS2125 1.0`10.0ìHF}20%...

 Open the catalog to page 10
Multilayer Chip Inductors for High Frequency HK series-11

mlci0109_reli_e-01 11 mlci0109_reli-PRP6 ¡ RELIABILITY DATA – This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 6. Q BK0402 —— BK0603 BK1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 20 min. CK2125 15`20 min. CKS2125 —— CKP2012 CKP2016 CKP2520 NM2012...

 Open the catalog to page 11
Multilayer Chip Inductors for High Frequency HK series-12

mlci0109_reli-PRP7 11 mlci0109_reli_e-01 ¡ RELIABILITY DATA – This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 8. Self Resonance Frequencyi SRFj BK0402 —— BK0603 BK1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 17`25MHz min. CK2125 24`235MHz min. CKS2125...

 Open the catalog to page 12

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