LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode MINI-MELF (LL34) HERMETICALLY SEALED GLASS C Features Surface device type mounting. Hermetically Sealed Glass. Matte Tin (Sn) Terminal Finish Pb free version and RoHS compliant A All external surfaces are corrosion resistant and terminals are readily solderable. Unit (mm) Unit (inch) Mechanical Data Case :MINI-MELF Package Terminal: Pure tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed High temperature soldering guaranteed: 260°C/10s Weight : 29 ± 2.5 mg Suggested PAD Layout Ordering Information 1.25 Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Maximum Ratings Symbol Power Dissipation Repetitive Peak Forward Current Thermal Resistance (Junction to Ambient) (Note 1) Junction and Storage Temperature Range Type Number Notes:1. Valid provided that electrodes are kept at ambient temperature

LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode Electrical Characteristics Type Number Break-over Voltage Break-over Voltage Symmetry Break-over Current Dynamic Breakover Voltage Leakage Current Output Voltage Tape & Reel specification TSC label Carrier width Sprocket hole Reel outside diameter Reel inner diameter Feed hole width Any Additional Label (If Required) Carrier depth Carieer Carrier length Sprocke hole position P1 Sprocke hole pitch Embossment center Punch hole position Overall tape thickness Tape width Reel width

LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode Rating and Characteristic Curves I IF=10m : Dynamic Breakover Voltage : Leakage Current at V B=0.5*VBO : Break-Over Current :Break-Over Voltage Diagram 1: Test Circuit FIG 1 Admissible Power Dissipation Curve FIG 3 Repetitive peak pulse current versus pulse duration (maximum values) FIG 2 Relative variation of VBO versus junction temperature (typical values) Repetitive peak pulse current (A)