LLDB3 Discrete Devices-DIAC & Thyristor-DIAC (Trigger Diode)

Product catalog summary

Overview: The document provides technical specifications and characteristics for the LLDB3-LLDB3TG, a 150mW bi-directional trigger diode designed for small signal applications. It is hermetically sealed in glass, ensuring corrosion resistance and solderability.

Mechanical Specifications: The diode is housed in a MINI-MELF package with dimensions ranging from 3.30 to 3.70 mm in length and 1.40 to 1.60 mm in diameter. The weight is approximately 29 ± 2.5 mg. The terminals are pure tin plated, lead-free, and comply with MIL-STD-202, Method 208 for solderability.

Electrical Characteristics: The diode features a break-over voltage (VBO) of 32V with a symmetry of ±3V. The break-over current (IBO) is specified at 10 μA, and the dynamic breakover voltage (ΔV) ranges from 28 to 30V. The leakage current at 0.5VBO is 15 μA.

Maximum Ratings: The power dissipation is rated at 150 mW, with a repetitive peak forward current of 2 A. The thermal resistance from junction to ambient is specified at 400°C/W. The operating and storage temperature range is from -40°C to +125°C.

Packaging Information: The diodes are available in tape and reel packaging, with a reel diameter of 178 mm and a capacity of 2.5K units per 7-inch reel. The tape width is 8.00 mm, and the reel width is a maximum of 14.4 mm.

Performance Curves: The document includes graphs illustrating the relationship between repetitive peak pulse current and pulse duration, the variation of VBO with junction temperature, and the power dissipation curve relative to ambient temperature.

Additional Features: The diode is RoHS compliant and guarantees high-temperature soldering at 260°C for 10 seconds.

Catalog excerpts

LLDB3 Discrete Devices-DIAC & Thyristor-DIAC (Trigger Diode)-1

LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode MINI-MELF (LL34) HERMETICALLY SEALED GLASS C Features Surface device type mounting. Hermetically Sealed Glass. Matte Tin (Sn) Terminal Finish Pb free version and RoHS compliant A All external surfaces are corrosion resistant and terminals are readily solderable. Unit (mm) Unit (inch) Mechanical Data Case :MINI-MELF Package Terminal: Pure tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed High temperature soldering guaranteed: 260°C/10s Weight : 29 ± 2.5 mg Suggested PAD Layout Ordering Information 1.25 Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Maximum Ratings Symbol Power Dissipation Repetitive Peak Forward Current Thermal Resistance (Junction to Ambient) (Note 1) Junction and Storage Temperature Range Type Number Notes:1. Valid provided that electrodes are kept at ambient temperature

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LLDB3 Discrete Devices-DIAC & Thyristor-DIAC (Trigger Diode)-2

LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode Electrical Characteristics Type Number Break-over Voltage Break-over Voltage Symmetry Break-over Current Dynamic Breakover Voltage Leakage Current Output Voltage Tape & Reel specification TSC label Carrier width Sprocket hole Reel outside diameter Reel inner diameter Feed hole width Any Additional Label (If Required) Carrier depth Carieer Carrier length Sprocke hole position P1 Sprocke hole pitch Embossment center Punch hole position Overall tape thickness Tape width Reel width

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LLDB3 Discrete Devices-DIAC & Thyristor-DIAC (Trigger Diode)-3

LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode Rating and Characteristic Curves I IF=10m : Dynamic Breakover Voltage : Leakage Current at V B=0.5*VBO : Break-Over Current :Break-Over Voltage Diagram 1: Test Circuit FIG 1 Admissible Power Dissipation Curve FIG 3 Repetitive peak pulse current versus pulse duration (maximum values) FIG 2 Relative variation of VBO versus junction temperature (typical values) Repetitive peak pulse current (A)

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