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BYG20D Discrete Devices -Diode-High Efficienct Recovery

BYG20D Discrete Devices -Diode-High Efficienct Recovery

BYG20D Discrete Devices -Diode-High Efficienct Recovery

Product catalog summary
Overview: The document provides technical specifications and characteristics for the BYG20D series of glass passivated junction chips, designed for surface-mounted applications. These chips are noted for their low forward voltage drop, fast switching capabilities, and high efficiency.
Specifications:
  • Maximum Repetitive Peak Reverse Voltage (VRRM): 200V to 600V depending on the model (BYG20D to BYG20J).
  • Maximum RMS Voltage (VRMS): 140V to 420V.
  • Maximum DC Blocking Voltage (VDC): 200V to 600V.
  • Average Forward Rectified Current (IF(AV)): 1.5A.
  • Peak Forward Surge Current (IFSM): 30A.
  • Maximum Reverse Recovery Time (Trr): 75 nanoseconds.
  • Operating and Storage Temperature Range: -55°C to +150°C.
Features:
  • Built-in strain relief suitable for automatic placement.
  • High-temperature soldering capability up to 260°C for 10 seconds at terminals.
  • Plastic material with Underwriters Laboratory Classification 94V-0.
  • Green compound options available.
Mechanical Data:
  • Case: Molded plastic.
  • Terminal: Pure tin plated, lead-free.
  • Polarity: Indicated by a cathode band.
  • Packing: 12mm tape per EIA STD RS-481.
  • Weight: 0.064 grams.
Performance Curves:
  • Forward Current Derating Curve: Shows the relationship between lead temperature and average forward current.
  • Maximum Non-Repetitive Forward Surge Current: Displays peak forward surge current against the number of cycles at 60 Hz.
  • Typical Reverse Characteristics: Illustrates instantaneous reverse current against the percentage of rated peak reverse voltage.
  • Typical Junction Capacitance: Shows capacitance against reverse voltage.
  • Typical Forward Characteristics: Displays instantaneous forward current against forward voltage.
Ordering Information: The document provides details on packaging options, including reel sizes and packing codes, with specific device codes ranging from "D" to "J".
Dimensions: Detailed dimensions for the package outline and suggested pad layout are provided, with measurements in both millimeters and inches.
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Catalog excerpts

BYG20D Discrete Devices -Diode-High Efficienct Recovery-1

1.5 AMPS High Efficient Surface Mount Rectifiers SMA/DO-214AC Features Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 260℃/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V-0 Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Case: Molded plastic Terminal: Pure tin plated, lead free Polarity: Indicated by cathode band Packing: 12mm tape per EIA STD RS-481 Weight: 0.064 grams Ordering Information (example) Part No. Packing code Packing code (Green) Maximum Ratings and Electrical Characteristics Rating at 25 ℃ ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Maximum Repetitive Peak Reverse Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) Maximum Instantaneous Forward Voltage (Note 1) Maximum Reverse Current @ Rated VR Pulse energy in avalanche mode, non repetitive (Inductive load switch off ) TA=25℃, L=120mH Maximum Reverse Recovery Time (Note 2) Typical Thermal Resistance Operating Temperature Range Storage Temperature Range Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A

 Open the catalog to page 1
BYG20D Discrete Devices -Diode-High Efficienct Recovery-2

RATINGS AND CHARACTERISTIC CURVES (BYG20D THRU BYG20J) FIG.1 FORWARD CURRENT DERATING CURVE FIG. 2 TYPICAL REVERSE CHARACTERISTICS FIG.6- REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM NOTES: 1. Rise Time=7ns max. Input lmpedance= 2. Rise Time=10ns max. Sourse Impedance^

 Open the catalog to page 2
BYG20D Discrete Devices -Diode-High Efficienct Recovery-3

Ordering information Part No. Folded SMA 7.5K / 13" Plastic REEL C SMA Packing code Packing code (Green) Note: "x" is Device Code from "D" thru "J". Tape & Reel specification Reel Size Tape Size 7" Reel Size Tape Size 13"

 Open the catalog to page 3
BYG20D Discrete Devices -Diode-High Efficienct Recovery-4

Package Outline Dimensions DIM. Date Code Green Compound Specific Device Code Marking Diagram

 Open the catalog to page 4

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.