Overview: This document provides technical specifications for the 1SMB5926 to 1SMB5956 series of 3.0 Watts Surface Mount Silicon Zener Diodes, designed for surface-mounted applications to optimize board space. The diodes are housed in a low-profile SMB/DO-214AA package with built-in strain relief and glass passivated junctions.
Mechanical Specifications:- Case: Molded plastic over passivated junction
- Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes positive end (cathode)
- Standard packaging: 12mm tape (EIA-481)
- Weight: 0.002 ounces (0.064 grams)
Features:- Low inductance
- High temperature soldering guaranteed at 260°C for 10 seconds at terminals
- Plastic package with Underwriters Laboratory Flammability Classification 94V-0
Maximum Ratings and Electrical Characteristics:- DC Power Dissipation at TL=75°C: 3.0 Watts
- Thermal Resistance from Junction-to-Lead: 25°C/W
- Thermal Resistance from Junction-to-Ambient: 226°C/W
- Operating and Storage Temperature Range: -65 to +150°C
Electrical Characteristics: The document lists detailed electrical characteristics for each
diode in the series, including Zener voltage range, Zener impedance, and leakage current. Each diode is marked with a specific code and has a tolerance of ±5%.
Graphs and Figures: The document includes several figures illustrating:
- Steady state power derating
- Maximum surge power
- Zener voltage characteristics
- Capacitance and pulse rating curves
Notes:- Nominal Zener voltage is measured with the device junction in thermal equilibrium at 25°C.
- Zener impedance is derived by dividing the AC voltage drop across the device by the AC current applied.
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