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KLC TTV (Thermal Test Vehicle)

KLC TTV (Thermal Test Vehicle)
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KLC TTV (Thermal Test Vehicle)

Product catalog summary
Overview
KLC Corporation's Thermal Test Vehicles (TTVs) are critical tools for validating thermal management solutions in AI servers, GPUs, CPUs, and advanced cooling systems. They simulate real chip heat loads, enabling engineers to test cooling performance prior to production.
Specifications and Features
TTVs are designed to mimic the heat output of CPUs, GPUs, and AI processors. The TTV 2.0 platform features standardized dimensions and a modular architecture, which helps reduce development costs and lead times. Key features include:
  • Heat flux up to 500 W/cm²
  • Multi-zone hotspot simulation
  • Integrated temperature sensors
  • Customizable dimensions and power outputs
Product Variants
The TTV product family includes:
  • Thin Plate TTV for low thermal resistance and high power density
  • Super High-Power TTV for high power applications
  • Multi-Zone Power TTV for simulating multiple hotspots
Applications
TTVs are utilized in various applications, such as:
  • Cold plate validation
  • Liquid cooling system testing
  • Two-phase cooling validation
  • AI server thermal development
  • Automotive ADAS thermal validation
Comparison: Traditional TTV vs. TTV 2.0
The TTV 2.0 platform offers benefits over traditional TTVs, including faster lead times, reduced development costs, and built-in temperature sensors.
Technical Capabilities
KLC's TTVs support a wide range of power and voltage configurations, with options for real-time temperature monitoring and control. They are compatible with various cooling systems, including liquid and immersion cooling.
FAQs
The document addresses common questions regarding selecting the right TTV, power density support, compatibility with cooling systems, and customization options.
Conclusion
KLC's TTVs are essential for evaluating and optimizing thermal management solutions, especially in high-power and high-density applications. They help reduce development risks and accelerate time-to-market for new cooling technologies.
Key Specifications
  • Extreme Power Density: Up to 500 W/cm², suitable for AI accelerators and HPC processors.
  • Multi-zone Control: Independent heating zones to simulate real IC hotspot distribution.
  • Immersion Cooling Compatibility: Features an ultra-thin dielectric layer for direct immersion and two-phase cooling.
  • Wide Power Range: From 80W to 6,000W per module, scalable via TTE stacking.
  • OAM Form Factor Support: Compatible with Open Accelerator Module standards for AI server validation.
  • Custom Design: Tailored to match specific chip dimensions and package footprints.
Applications
  • Thermal characterization of AI GPUs and accelerator chips (NVIDIA, AMD, Intel form factors).
  • Cooling validation for HPC servers and data centers (cold plates, CDUs, immersion tanks).
  • Thermal testing for DDR5 and PCIe Gen 5 modules.
  • Semiconductor package TDP validation (JEDEC JESD51-compatible).
  • Automotive chip thermal qualification (AEC-Q compliant environments).
Definition of Thermal Test Vehicle (TTV)
A TTV is a controllable heat-generating device designed to replicate the thermal behavior of CPUs, GPUs, AI accelerators, or automotive processors. It allows engineers to validate cooling solutions before production silicon is available.
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Catalog excerpts

KLC TTV (Thermal Test Vehicle)-1

Thermal Test Vehicle (TTV) Updated July 2026 | Reviewed by Charles Wu, Founder & CTO with 40+ years of heating engineering experience Thermal Validation Solutions for AI Servers, GPU, CPU and Advanced Cooling Systems High-Efficiency Thermal Management for AI, GPU & Data Centers Taiwan HQ info@ptc-heater.com.tw 28 Yatan Rd Sec 3 Taichung 427, TAIWAN

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KLC TTV (Thermal Test Vehicle)-2

Next-Generation Thermal Validation Solutions Designed for AI Chip, CPU/GPU, Cold Plate, Liquid Cooling and Two-Phase Cooling Validation As AI servers, GPUs, CPUs, and high-performance computing (HPC) platforms continue to increase in power density, accurate thermal validation has become essential for developing reliable cooling systems. Thermal Test Vehicles are becoming an essential validation platform for next-generation AI cooling technologies, including Direct Liquid Cooling (DLC), Microchannel Cold Plates (MCCP), Microchannel Lid (MCL), and future two-phase cooling systems. KLC provides...

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KLC TTV (Thermal Test Vehicle)-3

What is a Thermal Test Vehicle (TTV)? QUICK DEFINITION A Thermal Test Vehicle (TTV) is a precision thermal validation platform designed to simulate the heat generation of CPUs, GPUs, AI accelerators, ASICs, and power devices for evaluating thermal management solutions such as cold plates, liquid cooling, and Two-Phase Cooling Validation. KLC TTVs deliver controlled, repeatable heat flux with integrated temperature sensing, enabling engineers to characterize and validate cooling system performance before committing to production silicon. Application: TTVs enable engineers to validate thermal management...

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KLC TTV (Thermal Test Vehicle)-4

TTV 2.0 is KLC's next-generation Standardized Thermal Test Vehicle — a Complete AI Chip Thermal Test Platform for AI Server Cooling Validation, GPU Thermal Validation, CPU Thermal Simulation, and Cold Plate Performance Validation. Unlike fully customized TTV solutions, TTV 2.0 combines standardized dimensions and thicknesses with a modular platform architecture — reducing development cost and lead time while retaining full customization flexibility. High-Conductivity Hybrid Structure Low thermal resistance structure Multi-zone hotspot simulation with independent power zone control Size (mm) Voltage...

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KLC TTV (Thermal Test Vehicle)-5

Feature Conventional TTV TTV 2.0 Platform Design Approach Fully Customized Standardized + Lead Time Longer Faster Development Cost Higher Lower Dimensions Custom Every Project Standard Sizes + Custom Temperature Sensor Optional 100% Built-in T-type Platform Architecture Project-Based Modular Platform Comparison of Conventional TTV vs TTV 2.0 Platform across six features: design approach, lead time, development cost, dimensions, temperature sensor, and platform architecture Accelerate Cold Plate Thermal Qualification Without Live Silicon Risks. With AI chip TDP exceeding 2,000W+, testing cold...

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KLC TTV (Thermal Test Vehicle)-6

KLC Thermal Test Vehicle (TTV) Products PRODUCT FAMILY All next-generation KLC TTVs are built on the standardized TTV 2.0 Platform Super High-Power TTV (Thick Plate TTV) Works with the customer's compatible flat-processed equipment to match specific test environments or structures (specifically for OAM and high power). Thin Plate TTV Uses an ultra-thin dielectric layer for low-thermal-resistance, high-powerdensity heat transfer, closely simulating real chip behavior. Multi-Zone Power TTV Multi-zone power-controlled thermal simulation vehicle, used to simulate multiple hot spots and non-uniform...

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KLC TTV (Thermal Test Vehicle)-7

KLC Thermal Test Vehicle (TTV) Products PRODUCT FAMILY Custom KLC TTVs are built on the standardized TTV 2.0 Platform Super High-Power TTV with Bakelite Super High-Power TTV with Heatsink Uses a Bakelite board to ensure electrical isolation and insulation stability even during high-power output. Can be paired with heatsinks of different sizes and materials for validation of liquid cooling or air cooling functions. High-Power Thermal Test Emulator (TTE) Thermal Test Vehicle (TTV) Composed of multiple stacked TTVs in a single structure for intensified heating and enhanced heat dissipation, used...

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KLC TTV (Thermal Test Vehicle)-8

✓ Maximum total power up to 12,800W ✓ Single-zone and multi-zone heating ✓ Custom dimensions and geometries ✓ STEP files and 3D CAD support ✓ Validation for cold plate, liquid cooling, and two-phase cooling systems ✓ Support for AI server, HPC, and automotive ADAS applications • Adjustable Power Output - Set the required thermal load simply by adjusting the input voltage. • Wide Power Range - Supports diverse testing needs from low power to high heat flux density applications. • Simple & Safe Operation - Start at low voltage and gradually increase to the target wattage to ensure stable, safe...

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KLC TTV (Thermal Test Vehicle)-9

Thin Plate TTV (Thermal Test Vehicle) For thermal testing with spatial constraints or power density requirements Dimensions: 30 x 30 mm~80 x 80 mm Voltage: 12V ~ 600V Max Power (W) Examples Thin Plate TTV (Thermal Test Vehicle) 110V / 220V For quick testing scenarios without the need for complex power supplies. Varies by size and power configuration. Super High-Power Thermal Test Vehicle (TTV) Supports higher current and total power. Super High-Power TTV (Thermal Test Vehicle) 110V / 220V For quick testing scenarios without the need for complex power supplies. Varies by size and power configuration....

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KLC TTV (Thermal Test Vehicle)-10

Applications Chip & Thermal System Validation Use Cases KLC Thermal Test Vehicle (TTV) solutions simulate the thermal load of CPUs, GPUs, AI Accelerators, and automotive ADAS chips — enabling engineers to validate cooling system designs and thermal management before chip mass production. Cold Plate Validation Liquid Cooling System Testing Validate cold plate thermal resistance, heat dissipation performance, and flow conditions under various heat flux and power load scenarios. Evaluate liquid cooling capacity, flow distribution, and system stability under high-power operating conditions. Two-Phase...

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KLC TTV (Thermal Test Vehicle)-11

Recommended Solution Super High-Power TTV Multi-Zone TTV Thin Plate TTV TTE 1. How do I select the right Thermal Test Vehicle for my application? The optimal TTV depends on several factors, including: • Heat flux requirements • Total power requirements • Cooling architecture • Package dimensions • Hotspot simulation requirements AI Server Cold Plate Validation GPU Hotspot Simulation AI GPU Thermal Simulation Rack-Level Thermal Validation TTV (Thermal Test Vehicle) modules play a critical role in evaluating and optimizing thermal management solutions. Industries and components that particularly...

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