Overview: The document discusses the efficient heat transport from a heat source to a heatsink, facilitated by
vibration dampers and thermal interface materials. It highlights the use of COH thermal interface GEL series for superior thermal conductivity and heat dissipation.
Specifications: The COH thermal interface GEL series offers excellent thermal conductivity, adheres to rough surfaces, eliminates air gaps, and acts as a good electrical insulator and flame retardant. The document lists various technical properties and industry standards such as JIS R 2616, JIS K 2207, and JIS K 7312.
Technical Properties: The document provides detailed specifications for different models (e.g., COH-1019LVC, COH-4000LVC) including thermal conductivity, hardness, dielectric constant, tensile strength, and temperature range. It also mentions the appearance, specific gravity, and volume resistivity of these materials.
Installation and Features: The document includes an installation image and describes the lineup and features of the thermal interface materials. It emphasizes the importance of vibration protection for PCB components and the flexibility of the materials used.
Key Data: The document contains tables with data on needle penetration, dielectric breakdown strength, and other characteristics measured at different frequencies (e.g., <50Hz, <1kHz, <1MHz).
Recommendations: The document suggests using these materials for applications requiring efficient heat dissipation and vibration protection, highlighting their compliance with RoHS controlled substances and a wide temperature range (-40 to 150℃).
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