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Thermal Analysis

Thermal Analysis
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Thermal Analysis

Product catalog summary
Overview
This document provides a comprehensive guide to thermal analysis instruments by TA Instruments, focusing on Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), and related technologies. It includes detailed specifications, technologies, and applications for each instrument.
Differential Scanning Calorimetry (DSC)
  • Q2000: A high-performance DSC with advanced Tzero® and Modulated DSC® technologies, featuring a 50-position autosampler and Platinum™ software for scheduling tests.
  • Q200: A versatile DSC with Tzero® technology, expandable with MDSC®, designed for research applications.
  • Q20 Series: Cost-effective DSC modules suitable for research and quality control, including autosamplers and pressure DSC capabilities.
Technologies and Features
  • Tzero® Technology: Provides superior sensitivity and resolution with a unique cell design.
  • Platinum™ Software: Enhances data quality with automatic scheduling and notifications.
  • Cooling Accessories: Includes devices for isothermal, programmed, or ballistic cooling.
Applications
DSC is used in research, teaching, and quality control across various materials and conditions.
Refrigerated Cooling Systems (RCS)
Two models, RCS40 and RCS90, offer controlled and ballistic cooling for DSC operations, with RCS90 providing a broader temperature range.
Finned Air Cooling System (FACS)
A cost-effective cooling accessory for controlled cooling experiments and thermal cycling studies.
Quench Cooling Accessory (QCA)
Manually operated for quenching samples to sub-ambient temperatures.
Circulator Cooling System (CCS)
Adaptable to various cooling media, compatible with older DSC modules.
Liquid Nitrogen Cooling System (LNCS)
Offers high performance with a wide temperature range and autofill capability.
Tzero DSC Technology
Improves heat flow measurement accuracy by incorporating cell resistance and capacitance characteristics.
Modulated DSC (MDSC) Technology
Separates complex transitions into interpretable components, increasing sensitivity and resolution.
Applications and Performance
DSC is used for determining transition temperatures, heat flow, and thermal history of samples, with applications in pharmaceuticals and polymers.
Thermogravimetric Analysis (TGA)
Provides detailed specifications and applications of TGA techniques, highlighting their importance in analyzing material properties.
Degree of Cure
DSC is used to determine the degree of cure in thermosetting materials like epoxy.
Pharmaceutical Polymorph Analysis
DSC is key for detecting polymorphs in pharmaceutical materials.
Applications of Pressure DSC
Used to accelerate oxidation induction time analyses and improve detection of oxidation processes.
Photocuring
The Photocalorimeter Accessory (PCA) assesses UV/Visible light-initiated reactions.
Technical Specifications of TGA Models
Specifications for Q5000 IR, Q500, and Q50 TGA models, detailing features like temperature range and weighing precision.
Furnace Design and Temperature Measurement
The Q5000 IR features an infrared furnace with precise temperature control.
Performance Verification and Calibration
Use of certified reference materials for verifying TGA performance.
Purge Gas System
Enhances data quality by minimizing buoyancy effects and optimizing decomposition product removal.
Conclusion
Emphasizes the advanced capabilities and user-friendly features of the Q5000 IR, Q500, and Q50 TGAs.
Vapor Sorption Analysis
Technical specifications for VTI-SA and Q5000 SA vapor sorption analyzers, focusing on balance capacity, weighing accuracy, and humidity control.
Symmetrical Microbalance Design
Enhances accuracy by focusing on the sample's uptake alone.
Precision Humidity Measurements
Ensures stability and accuracy without drift.
Sorption Testing with Organic Vapor
Handles organic vapor sorption by controlling vapor concentration.
Applications in Pharmaceutical Analysis
Evaluates hydrate formation, morphological stability, and amorphous structure in pharmaceuticals.
Dynamic Mechanical Analysis (DMA) - Q800
Measures mechanical properties of materials, suitable for high-stiffness applications like composites.
Modes of Operation
Various modes help in assessing viscoelastic properties under different conditions.
Q800 Technology
Features a non-contact drive motor, air bearings, and optical encoder for precise measurements.
Applications: Measurement of Tg of Polymeric Materials
DMA is the most sensitive technique for measuring the glass transition temperature (Tg) of polymers.
Characterizing Packaging Films Using Creep
Creep-recovery experiments predict the stability of packaging films during thermoforming processes.
Predicting Material Performance Using Time/Temperature Superpositioning (TTS)
TTS predicts material performance at different frequencies or time scales.
Characterizing Printed Circuit Boards
Challenges in measuring Tg in PCBs due to low resin content.
Effect of Carbon Black in Elastomers
Increases storage modulus and Tg, illustrating the impact of fillers on material properties.
Technical Specifications of Q400EM/Q400
Advanced features for viscoelastic material characterization.
Dynamic TMA Mode (Q400EM)
Applies a sinusoidal force and a linear temperature ramp to a sample.
Modulated TMA (MTMA; Q400EM)
Detects dimension changes and time-dependent kinetic processes.
Material Performance and Selection
3-point bending mode experiment determines distortion temperature under load.
Intrinsic and Product Property Measurements
Expansion and penetration probe measurements determine Tg and softening point.
Accurate Coefficient of Thermal Expansion Measurements
Measures small CTE changes in aluminum over a 200°C range.
Fiber Stress/Strain Measurements
Assesses materials, showing different regions of behavior in polyamide fiber under tension.
Thermal Stress Analysis of Fibers
Tensile mode experiment on polyolefin fiber shows forces needed to maintain strain.
Shrinkage Force Testing
Simulates use from freezer to microwave, showing force variation required to maintain set strain.
Film Tensile Testing
Strain ramp experiment on polymeric film shows linear stress-strain relationship.
Viscoelastic Property Determination - Dynamic TMA
Calculates viscoelastic properties, showing modulus changes through glass transition temperature.
Separating Overlapping Transitions - Modulated TMA™
Separates Tg from stress relaxation events, providing clearer analysis.
Creep Analysis
Reveals strain response to stress and recovery, useful for material selection.
Stress Relaxation Analysis
Shows typical decay in stress relaxation modulus, aiding material design.
See more

Catalog excerpts

Thermal Analysis-1

Thermal Analysis INSTRUMENTS

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Thermal Analysis-3

Technology 77 Sorption Analyzer 82 Q5000SA 83 Q5000SA Technology 87 Applications 91 DYNAMIC MECHANICAL ANALYSIS 97 Deformation Modes & Sample Size 99 of Operation 100 Technology 101 of Deformation 103 Accessories 105 Theory 106 Applications 107 THERMOMECHANICAL ANALYSIS Q400EM / Q400 113 Technology 115 of Deformation 117 Theory / Modes of Operation 119 Applications 123

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Thermal Analysis-4

Differential Scanning Calorimetry

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Thermal Analysis-5

4 Technologies Tzero® Technology Advanced MDSC® Advanced Direct Cp Measurement Included Platinum™ Software Included Hardware Features SVGA Touch Screen Included User Replaceable Tzero Cell Yes 50-Position Autosampler Included Autolid Included Dual Digital Mass Flow Controllers Included Full Range of Cooling Accessories Available (LNCS, RCS90, RCS40, CCS, FACS, QCA) Pressure DSC Available Photocalorimeter Available Performance Temperature Range Ambient to 725 °C With Cooling Accessories -180 to 725 °C Temperature Accuracy +/- 0.1 °C Temperature Precision +/- 0.01 °C Calorimetric Reproducibility...

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Thermal Analysis-6

6 Technologies Tzero® Technology Basic MDSC® Optional Platinum™ Software Included Hardware Features SVGA Touch Screen Included Tzero Cell (fixed position) Included 50-Position Autosampler Available Autolid Included Dual Digital Mass Flow Controllers Included Full Range of Cooling Accessories Available (LNCS, RCS90, RCS40, CCS, FACS, QCA) Photocalorimeter Available Performance Temperature Range Ambient to 725 °C With Cooling Accessories -180 to 725 °C Temperature Accuracy +/- 0.1 °C Temperature Precision +/- 0.05 °C Calorimetric Reproducibility (indium metal) +/- 0.1 % Calorimetric Precision (indium...

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Thermal Analysis-7

8 Hardware Features Q20 AQ20 Q20P Tzero® Cell (fixed position) Included Included — User Replaceable Cell — — Yes 50-Position Autosampler — Included — Autolid — Included — Dual Digital Mass Flow Controllers Included Included — Full Range of Cooling Accessories Available Available QCA Only (LNCS, RCS90, RCS40, CCS, FACS, QCA) Pressure DSC — — Yes Platinum Software — Included — Performance Temperature Range Amb to 725 °C Amb to 725 °C Amb to 725 °C With Cooling Accessories -180 to 725 °C -180 to 725 °C -130 to 725 °C Temperature Accuracy +/- 0.1 °C +/- 0.1 °C +/- 0.1 °C Temperature Precision +/-...

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Thermal Analysis-8

COOLING RODS & RING The unique design features an array of nickel cooling rods that connect the silver furnace with the cooling ring. This design produces superior cooling performance over a wide temperature range, higher cooling rates and better agility from heating to cooling operation. Lower sub-ambient temperatures and faster turnaround time can be obtained with our expanded range of cooling accessories in isothermal, programmed or ballistic cooling, and MDSC® experiments. FURNACE The Tzero® transducer is enclosed in a high thermal conductivity, silver furnace, which uses rugged, long-life...

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Thermal Analysis-9

TZERO® DSC SAMPLE ENCAPSULATION PRESS A key contributor to the quality of DSC results is the sample preparation. The new Tzero press takes sample encapsulation to a higher level of performance and convenience in crimp and hermetic sealing of a wide variety of materials. The press kit includes die sets (4) for the new Tzero aluminum and Tzero hermetic pans & lids and also for our upgraded standard and hermetic pans & lids (optional die sets are available for hi-volume DSC pans and Q5000 TGA sealed pans). The die sets are magnetically attached with no tools or user adjustments required. In addition,...

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Thermal Analysis-10

14 -10 -8 -4 -6 -2 0 154 155 156 157 158 159 160 Temperature (°C) Q2000 Data Q1000 Data Heat Flow (mW) 2 Further to TA Instruments’ commitment to continuous quality improvement in DSC pan & lid technology, significant improvements in our standard aluminum crimped pans have also been realized. The result is a significant improvement in standard performance tests on indium metal. Note the improved sharpness of the melting peak, indicative of faster response and better resolution performance. STANDARD PANS / LIDS DSC pans & lids are available in aluminum, alodine-coated aluminum, gold, platinum,...

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Thermal Analysis-11

High quality DSC experiments require precise purge gas flow rates. Mass flow controllers, along with integrated gas switching, provide flexible control as part of individual methods. Purge gas flow rates are settable from 0-240 mL/min in increments of 1 mL/min. The system is precalibrated for helium, nitrogen, air and oxygen and suitable calibration factors may be entered for other gases. Pressure DSC The Q20P is a dedicated pressure DSC System that provides heat flow measurements on pressure sensitive materials from -130 to 725 °C, at pressures from 1 Pa (0.01 torr) to 7 MPa (1,000 psi). The...

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Thermal Analysis-12

18 RCS40 Controlled Cooling Rates, from 400 °C (upper limit)* CONTROLLED RATE TO LOWER TEMPERATURE 65 °C/min 250 °C 50 °C/min 175 °C 20 °C/min 40 °C 10 °C/min 0 °C 5 °C/min -15 °C 2 °C/min -40 °C * Performance may vary slightly, depending on laboratory conditions. RCS40 The RCS40 employs a single-stage refrigeration system, which permits convenient DSC and MDSC® operation over the temperature range from -40 °C to 400 °C. Typical RCS40 controlled cooling rates are detailed in the table below. Ballistic cooling from 400 °C to ambient is achieved in about 7 minutes. The RCS40 is compatible with...

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Thermal Analysis-13

20 FINNED AIR COOLING SYSTEM The Finned Air Cooling System (FACS) is an innovative cooling accessory for all the Q Series™ DSC modules that offers a cost-effective alternative to the RCS or LNCS cooling systems. The FACS can be used for controlled cooling experiments, thermal cycling studies, and to improve sample turnaround time. Stable baselines and linear heating and cooling rates can be achieved between ambient and 725 °C. QUENCH COOLING ACCESSORY The Quench Cooling Accessory (QCA) is a manually operated cooling accessory, whose primary use is with the Q20 DSC to quench cool a sample to a...

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