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IPC/COMPACT6 -ML

IPC/COMPACT6 -ML

IPC/COMPACT6 -ML

Product catalog summary
Overview: The document provides technical specifications and features of the Industrial Compact PC, IPC/COMPACT6 "ML-Family" by Syslogic Datentechnik AG. It includes details on operating systems, industrial-specific properties, features, system components, communication interfaces, and technical data.
Operating Systems: The IPC/COMPACT6 supports multiple operating systems including Windows NT embedded, Windows XP embedded, Windows CE, Linux, VxWorks, OS-9, MS-DOS, RTX-DOS 16/32, RTKernel, RTOS-32, and others upon request.
Industrial Specific Properties: Key features include a real-time clock, watchdog, temperature supervision, flash BIOS, socket for battery-buffered memory, CAN interfaces with ESD protection, DIN rail mounting, no active cooling requirement, and a 24V power supply voltage.
Features: The system is rugged, maintenance-free, long-term available, and has no rotating parts. It includes CE, vibration and shock resistance, EMV, ESD protection, and burn-in tests/certifications.
System Components: The system is powered by an AMD Geode LX800 processor at 500MHz, with RAM on board, flash ROM drive, and sockets for SRAM, DiskOnChip, NV-RAM, and CompactFlash. It supports graphic resolutions up to UXGA, Ethernet, USB, RS232, RS485, and PC/104, PCI/104 interfaces.
Communication Interfaces: The system includes USB 2.0 ports, Ethernet 10/100 Mbit interfaces, RS232 and RS485 ports with ESD protection, a parallel interface, and CAN 2.0b interfaces.
Technical Data: The dimensions are 228.6 x 47.5 x 127.1 mm. It operates on an input voltage of 10-30VDC (non-isolated) or 19-30VDC (isolated). The power consumption is a maximum of 12-13 Watts at 24V without add-ins. The operating temperature range is 0° to 50°C, with a storage temperature range of -40° to +90°C. It is designed to meet shock and vibration standards EN60068-2-6 and EN60068-2-27, and EMI conformity standards EN-55022/55024/61000-6-2/61000-6-4.
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Catalog excerpts

IPC/COMPACT6 -ML-1

IPC/COMPACT6 “ML-Family” Multi Interface System Rugged Maintenance-free Long term available No rotating parts DIN rail mounting CAN Fieldbus interfaces Expandable (PC/104, PCI/104) Features Industrial specific properties Industrial x86Processor 500MHz RAM on Board Flash ROM Drive Socket for SRAM, DiskOnChip, NV-RAM Socket for CompactFlash Graphic resolution up to UXGA Ethernet, USB RS232, RS485 PC/104, PCI/104 interfaces Real Time Clock Watchdog Temperature supervision Flash BIOS Socket for battery buffered Memory CAN interfaces (SJA1000) ESD-protection on all interfaces DIN Rail Mounting No active cooling required 24V Power Supply Voltage Windows NT embedded Windows XP embedded Windows CE Linux VxWorks OS-9 MS-DOS, RTX-DOS 16/32 RTKernel, RTOS-32 others on request Inverter Voltage Power Supply I/O Companion AMD CS5536 (South Bridge) PCI/ISA Bridge ATA-S Controller (DMA/PIO Mode) AC97 Controller Real Time Clock System Register Configuration Switch Reset Logic ISA Bus USB0...USB3 (Version 2.0 High/Full Speed) SRAM, EEPROM 32 Pin Socket Boot Flash (BIOS) 1.44MB ROM Drive Power Fail Detection Parallel Port CE Vibration and Shock EMV ESD Burn-In Operating Systems CompactFlash Connector Codec

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IPC/COMPACT6 -ML-2

Order Code Specifications and Order Information Standard Temperature Range Extended Temperature Range Processor/Performance AMD Geode [email protected] 500 MHz, 1000 MIPS Memory 128 kB L1 Cache (64kB instruction / 64kB data) 128 kB L2 Cache 512 MB DDR400 SDRAM 1,44MB ROM Floppy emulation 32 Pin Socket for SRAM,NV-RAM, EEPROM5, DiskOnChip5 Socket for CompactFlash IDE Mode (Type I) Peripherals Graphic Controller up to 1920x1440 resolution IDE Interface Standard (1 Master, 1 Slave) PS/2 (Mouse/Keyboard) Mouse/Keyboard (Header) PC/104 Bus Interface Audio Port (AC97) 1 5 Rotary Hex-Switch for user defined...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.