EddyCus® TF map 2530RM
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Efficient Testing Solutions SURACUS®) Sensors & Instruments 1 EddyCus® TF map 2530RM - Resistivity Imaging Device Highlights Processes ► Contact-free imaging ► High speed (10,000 points in 5 min) ► Repeatable and accurate ► High resolution (9 to 90,000 points) ► Mapping of encapsulated layers ► Homogeneity and defect imaging ► Classification and sorting ► Ingot casting and drawing (FZ, CZ) ► Implantation and doping ► Annealing and tempering ► Composition & structure assessment ► Melting, sintering, heat treatment ► EDM processability SURAGUS GmbH Maria-Reiche-Strasse 1 01109 Dresden Germany For further questions: +49 351 32 111 520 Applications ► Wafer resistivity imaging ► Ingot and boule resistivity imaging ► Sputter target composition imaging ► Purity assessment ► Electrical discharge machining ► Material sorting and homogeneity assessment ► Melting, casting, sintering ► Defect imaging and integrity assessment Materials ► Semiconductors ► Si (mono, poly) ► SiC, SiSiC ► GaAs ► GaN ► Alloys ► Metals ► Graphite ► Graphene ► Compounds ► Composites Visit us at: www.suragus.com www.suragus.com/calculator www.suragus.com/EddyCusMap2530 Made and Engineered in Germany jec ^ WINNER 0F2016 INNOVATION AWARD

Measurement technology Substrates Max. scanning area Edge effect correcton / exclusion Max. sample thickness / sensor gap Resistvity range Conductvity range High frequency eddy current sensor Flat, slightly curved wafer, boules and pucks 300 mm x 300 mm x 10 mm 2-10 mm (depending on size, measurement range and requirements) 10 mm 0.002 -0.1 mOhm-cm 0.1 -100 mOhm-cm 100 -1,000 mOhm-cm 0.01-65 MS/m Min. pitch Mode Speed Device dimensions (w/h/d) / weight Further available features 0.1 mm Contact and non-contact 400 mm per second (tme 1 to 30 minutes) 799 x 486 x 850 mm / 31.5" x 19.1" x 33.5"...