EddyCus® TF map 2530RM

Product catalog summary

Overview: The EddyCus® TF map 2530RM is a resistivity imaging device designed for efficient, contact-free testing solutions. It offers high-speed, repeatable, and accurate imaging with high resolution, suitable for mapping encapsulated layers and assessing homogeneity and defects.

Highlights:

Contact-free imaging with high speed (10,000 points in 5 minutes).
High resolution ranging from 9 to 90,000 points.
Capable of mapping encapsulated layers and imaging defects.

Applications:

Wafer and ingot resistivity imaging.
Sputter target composition imaging and purity assessment.
Material sorting, homogeneity assessment, and defect imaging.

Processes:

Classification and sorting, ingot casting, and drawing.
Implantation, doping, annealing, and tempering.
Composition and structure assessment, melting, sintering, and heat treatment.

Materials: Suitable for semiconductors, alloys, metals, graphite, graphene, compounds, and composites.

Technical Specifications:

Measurement technology: High frequency eddy current sensor.
Max scanning area: 300 mm x 300 mm x 10 mm.
Resistivity range: 0.002 – 1,000 mOhm·cm.
Conductivity range: 0.01 – 65 MS/m.
Device dimensions: 799 x 486 x 850 mm; Weight: 90 kg.

Device Control and Software:

Pre-defined measurement and product recipes.
Line scan, histogram, and area analysis with image coding.
Data export options including csv, pdf, and SPC summary.
Material database for parameter conversion and edge effect compensation.

Additional Features: Includes sheet resistance imaging, metal thickness imaging, and anisotropy and sheet resistance sensor.

Note: Last updated in February 2021, content is subject to change.

Catalog excerpts

Efficient Testing Solutions SURACUS®) Sensors & Instruments 1 EddyCus® TF map 2530RM - Resistivity Imaging Device Highlights Processes ► Contact-free imaging ► High speed (10,000 points in 5 min) ► Repeatable and accurate ► High resolution (9 to 90,000 points) ► Mapping of encapsulated layers ► Homogeneity and defect imaging ► Classification and sorting ► Ingot casting and drawing (FZ, CZ) ► Implantation and doping ► Annealing and tempering ► Composition & structure assessment ► Melting, sintering, heat treatment ► EDM processability SURAGUS GmbH Maria-Reiche-Strasse 1 01109 Dresden Germany For further questions: +49 351 32 111 520 Applications ► Wafer resistivity imaging ► Ingot and boule resistivity imaging ► Sputter target composition imaging ► Purity assessment ► Electrical discharge machining ► Material sorting and homogeneity assessment ► Melting, casting, sintering ► Defect imaging and integrity assessment Materials ► Semiconductors ► Si (mono, poly) ► SiC, SiSiC ► GaAs ► GaN ► Alloys ► Metals ► Graphite ► Graphene ► Compounds ► Composites Visit us at: www.suragus.com www.suragus.com/calculator www.suragus.com/EddyCusMap2530 Made and Engineered in Germany jec ^ WINNER 0F2016 INNOVATION AWARD

Open the catalog to page 1

Measurement technology Substrates Max. scanning area Edge effect correcton / exclusion Max. sample thickness / sensor gap Resistvity range Conductvity range High frequency eddy current sensor Flat, slightly curved wafer, boules and pucks 300 mm x 300 mm x 10 mm 2-10 mm (depending on size, measurement range and requirements) 10 mm 0.002 -0.1 mOhm-cm 0.1 -100 mOhm-cm 100 -1,000 mOhm-cm 0.01-65 MS/m Min. pitch Mode Speed Device dimensions (w/h/d) / weight Further available features 0.1 mm Contact and non-contact 400 mm per second (tme 1 to 30 minutes) 799 x 486 x 850 mm / 31.5" x 19.1" x 33.5" /...

Open the catalog to page 2

All SURAGUS GmbH catalogs and technical brochures

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

Brand list