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STPS5L25 Low drop power Schottky rectifier

STPS5L25 Low drop power Schottky rectifier
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STPS5L25 Low drop power Schottky rectifier - 1

STPS5L25 Low drop power Schottky rectifier Datasheet − production data Description Single Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged in DPAK, this device is intended for use as a rectifier at the secondary of 3.3 V SMPS units. Table 1. Device summary Symbol Features • Very low forward voltage drop for less power dissipation and reduced heatsink • Optimized conduction/reverse losses trade-off which means the highest efficiency in the applications • High power surface mount miniature package • Avalanche specification • ECOPACK®2 compliant component for DPAK on demand January 2015 This is information on a product in full production.

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Characteristics Table 2. Absolute ratings (limiting values, at 25 °C unless otherwise stated) Symbol Repetitive peak reverse voltage Average forward current, square wave Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Static electrical characteristics Symbol Test conditions Reverse leakage current Forward voltage drop 1. Pulse test: tp = 380 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2%...

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STPS5L25 Low drop power Schottky rectifier - 3

Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) Figure 3. Normalized avalanche power derating versus pulse duration at Tj = 125 °C Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Figure 5. Reverse leakage current versus reverse voltage applied (typical values) Figure 6. Junction capacitance versus reverse voltage applied (typical values)

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STPS5L25 Low drop power Schottky rectifier - 4

Figure 7. Forward voltage drop versus forward current (maximum values) Figure 8. Thermal resistance junction to ambient versus copper surface under tab

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Package Information Package Information • Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. DPAK dimension definitions This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.

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Package Information STPS5L25 Table 5. DPAK dimension values Dimensions Figure 10. DPAK footprint dimensions (in mm)

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Ordering information Ordering information Table 6. Ordering information Order code Delivery mode Revision history Table 7. Document revision history Date Reformatted to current standard. Corrected order code in Table 5. Updated package information and reformatted to current standard. Previous release.

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IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application...

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