STGB8NC60KD - STGD8NC60KD STGF8NC60KD - STGP8NC60KD 600 V - 8 A - short circuit rugged IGBT Features ■ Lower on voltage drop (VCE(sat)) Lower CRES / CIES ratio (no cross-conduction susceptibility) Very soft ultra fast recovery antiparallel diode Short circuit withstand time 10 µs High frequency motor controls SMPS and PFC in both hard switch and resonant topologies Motor drivers Internal schematic diagram This IGBT utilizes the advanced PowerMESH™ process resulting in an excellent trade-off between switching performance and low on-state behavior. Device summary Order codes
Open the catalog to page 1Electrical characteristics (curves) Test circuit Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Open the catalog to page 2Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Value Collector current (continuous) at TC = 25 °C Collector current (continuous) at TC = 100 °C Turn-off latching current Pulsed collector current Gate-emitter voltage Diode RMS forward current at TC = 25 °C Surge not repetitive forward current tp = 10 ms sinusoidal Insulation withstand voltage (RMS) from all three leads to external hea sink ( t=1 s; TC = 25 °C) Operating junction temperature Short circuit withstand time , (VCE = 0.5 VBR(CES) , TC = 125 °C, RG = 10 Ω VGE = 12 V) 1. Calculated according to the iterative formula:...
Open the catalog to page 3Electrical characteristics Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. Symbol Static Parameter Collector-emitter V(BR)CES breakdown voltage (VGE= 0) Test conditions Gate threshold voltage Collector cut-off current (VGE = 0) Collector-emitter saturation VGE= 15 V, IC = 3 A voltage VGE= 15 V, IC = 3 A, TC = 125°C Gate-emitter leakage current (VCE = 0) Forward transconductance 1. Pulse duration = 300 us, duty cycle 1.5 % Table 5. Symbol Cies Coes Cres Qg Qge Qgc Table 6. Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on Dynamic Parameter Input capacitance Output capacitance...
Open the catalog to page 4STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Table 6. Symbol tr(Voff) td(off) tf tr(Voff) td(off) tf Electrical characteristics Switching on/off (inductive load) (continued) Parameter Off voltage rise time Turn-off delay time Current fall time Off voltage rise time Turn-off delay time Current fall time Test conditions Switching energy (inductive load) Parameter Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses Test conditions 1. Eon is the turn-on losses when a typical diode is used in the...
Open the catalog to page 5Electrical characteristics Electrical characteristics (curves) Output characteristics Transfer characteristics Collector-emitter on voltage vs temperature Gate charge vs gate-source voltage Figure 7. Capacitance variations
Open the catalog to page 6Normalized gate threshold voltage vs temperature Figure 10. Normalized breakdown voltage vs temperature Electrical characteristics Collector-emitter on voltage vs collector current Figure 11. Switching losses vs temperature Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current
Open the catalog to page 7Electrical characteristics Figure 14. Thermal impedance for TO-220/ D²PAK Figure 16. Forward voltage drop versus forward current Figure 17. Thermal impedance for DPAK Figure 18. Thermal impedance for TO-220FP
Open the catalog to page 8Test circuit Test circuit Figure 19. Test circuit for inductive load switching Figure 20. Gate charge test circuit Figure 21. Switching waveform Figure 22. Diode recovery time waveform
Open the catalog to page 9Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
Open the catalog to page 10Package mechanical data
Open the catalog to page 11Package mechanical data TO-252 (DPAK) mechanical data DIM.
Open the catalog to page 12Package mechanical data D²PAK (TO-263) mechanical data
Open the catalog to page 13Package mechanical data
Open the catalog to page 14Packaging mechanical data Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. TAPE MECHANICAL DATA
Open the catalog to page 15Packaging mechanical data DPAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. TAPE MECHANICAL DATA
Open the catalog to page 16Revision history Revision history Table 9. Document revision history First release Updated Figure 14 and Figure 17
Open the catalog to page 17Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of...
Open the catalog to page 1814 Pages
16 Pages
8 Pages
42 Pages
13 Pages
15 Pages
15 Pages
25 Pages
19 Pages
20 Pages
19 Pages
14 Pages
80 Pages
76 Pages
82 Pages
78 Pages
13 Pages
65 Pages
40 Pages
59 Pages
13 Pages
20 Pages
17 Pages
32 Pages
24 Pages
17 Pages
16 Pages
8 Pages
10 Pages
14 Pages
34 Pages
34 Pages
31 Pages
6 Pages
2 Pages