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STGB8NC60KD - STGD8NC60KD STGF8NC60KD - STGP8NC60KD

STGB8NC60KD - STGD8NC60KD STGF8NC60KD - STGP8NC60KD
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STGB8NC60KD - STGD8NC60KD STGF8NC60KD - STGP8NC60KD - 1

STGB8NC60KD - STGD8NC60KD STGF8NC60KD - STGP8NC60KD 600 V - 8 A - short circuit rugged IGBT Features ■ Lower on voltage drop (VCE(sat)) Lower CRES / CIES ratio (no cross-conduction susceptibility) Very soft ultra fast recovery antiparallel diode Short circuit withstand time 10 µs High frequency motor controls SMPS and PFC in both hard switch and resonant topologies Motor drivers Internal schematic diagram This IGBT utilizes the advanced PowerMESH™ process resulting in an excellent trade-off between switching performance and low on-state behavior. Device summary Order codes

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Electrical characteristics (curves) Test circuit Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Value Collector current (continuous) at TC = 25 °C Collector current (continuous) at TC = 100 °C Turn-off latching current Pulsed collector current Gate-emitter voltage Diode RMS forward current at TC = 25 °C Surge not repetitive forward current tp = 10 ms sinusoidal Insulation withstand voltage (RMS) from all three leads to external hea sink ( t=1 s; TC = 25 °C) Operating junction temperature Short circuit withstand time , (VCE = 0.5 VBR(CES) , TC = 125 °C, RG = 10 Ω VGE = 12 V) 1. Calculated according to the iterative...

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Electrical characteristics Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. Symbol Static Parameter Collector-emitter V(BR)CES breakdown voltage (VGE= 0) Test conditions Gate threshold voltage Collector cut-off current (VGE = 0) Collector-emitter saturation VGE= 15 V, IC = 3 A voltage VGE= 15 V, IC = 3 A, TC = 125°C Gate-emitter leakage current (VCE = 0) Forward transconductance 1. Pulse duration = 300 us, duty cycle 1.5 % Table 5. Symbol Cies Coes Cres Qg Qge Qgc Table 6. Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on Dynamic Parameter Input capacitance Output...

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Table 6. Symbol tr(Voff) td(off) tf tr(Voff) td(off) tf Electrical characteristics Switching on/off (inductive load) (continued) Parameter Off voltage rise time Turn-off delay time Current fall time Off voltage rise time Turn-off delay time Current fall time Test conditions Switching energy (inductive load) Parameter Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses Test conditions 1. Eon is the turn-on losses when a typical diode is used in...

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Electrical characteristics Electrical characteristics (curves) Output characteristics Transfer characteristics Collector-emitter on voltage vs temperature Gate charge vs gate-source voltage Figure 7. Capacitance variations

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Normalized gate threshold voltage vs temperature Figure 10. Normalized breakdown voltage vs temperature Electrical characteristics Collector-emitter on voltage vs collector current Figure 11. Switching losses vs temperature Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current

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Electrical characteristics Figure 14. Thermal impedance for TO-220/ D²PAK Figure 16. Forward voltage drop versus forward current Figure 17. Thermal impedance for DPAK Figure 18. Thermal impedance for TO-220FP

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Test circuit Test circuit Figure 19. Test circuit for inductive load switching Figure 20. Gate charge test circuit Figure 21. Switching waveform Figure 22. Diode recovery time waveform

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Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

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Package mechanical data

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Package mechanical data TO-252 (DPAK) mechanical data DIM.

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Package mechanical data D²PAK (TO-263) mechanical data

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Package mechanical data

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Packaging mechanical data Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. TAPE MECHANICAL DATA

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Packaging mechanical data DPAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. TAPE MECHANICAL DATA

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Revision history Revision history Table 9. Document revision history First release Updated Figure 14 and Figure 17

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Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use...

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