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STGB14NC60K STGD14NC60K

STGB14NC60K STGD14NC60K
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STGB14NC60K STGD14NC60K N-channel 14A - 600V -DPAK - D2PAK Short circuit rated PowerMESH™ IGBT General features Type Low on-voltage drop (Vcesat) Low Cres / Cies ratio ( no cross conduction susceptibility) Short circuit withstand time 10µs Description Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the Power MESH™ IGBTs, with outstanding performances. The suffix “K” identifies a family optimized for high frequency motor control applications with short circuit withstand capability. Internal schematic diagram High frequency inverters Motor drivers with short circuit protection Order codes Part number Tape & reel Tape & reel

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Electrical characteristics (curves) Test circuit Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Symbol VCES Collector current (continuous) at TC = 25°C Collector current (continuous) at TC = 100°C Collector current (pulsed) Gate-emitter voltage Short circuit withstand time, VCE = 0.5VBR(CES) , Tj = 125°C, RG = 10Ω, VGE = 12V Rthj-case Thermal resistance junction-case max Operating junction temperature Calculated according to the iterative formula: Thermal resistance Parameter Thermal resistance junction

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Electrical characteristics Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol VBR(CES) Static Parameter Test condictions Collector-emitter breakdown IC= 1mA, VGE= 0 voltage Gate-emitter leakage current (VCE = 0) Collector cut-off current (VGE = 0) VCE= Max rating, TC= 25°C VCE= Max rating, TC= 125°C Gate threshold voltage Collector-emitter saturation voltage Forward transconductance 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5% Dynamic Parameter Test condictions Input capacitance Output capacitance Reverse transfer capacitance Total gate charge...

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Electrical characteristics Switching on/off (inductive load) Turn-on delay time Current rise time Turn-on current slope Turn-on delay time Current rise time Turn-on current slope Off voltage rise time Turn-off delay time Current fall time Off voltage rise time Turn-off delay time Current fall time Test condictions Switching energy (inductive load) Parameter Test condictions Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses 1. Eon is the turn-on losses when a typical diode is used in the test...

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Electrical characteristics Electrical characteristics (curves) Output characterisics Transfer characteristics Collector-emitter on voltage vs temperature Collector-emitter on voltage vs collector current Normalized gate threshold vs temperature

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Electrical characteristics Normalized breakdown voltage vs temperature Gate charge vs gate-emitter voltage Capacitance variations Figure 10. Switching losses vs temperature Figure 11. Switching losses vs gate resistance Figure 12. Switching losses vs collector current

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Electrical characteristics Figure 13. Thermal impedance Figure 15. Thermal impedance for D²PAK

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Test circuit Test circuit Figure 16. Test circuit for inductive load switching Figure 17. Gate charge test circuit Figure 18. Switching waveforms Figure 19. Diode recovery times waveform

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Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

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Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm.

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Package mechanical data DPAK MECHANICAL DATA mm.

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Packaging mechanical data Packaging mechanical data DPAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. TAPE MECHANICAL DATA

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Packaging mechanical data TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. TAPE MECHANICAL DATA

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Revision history Revision history Table 7. Revision history

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Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use...

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