Swing-DUO™ software datasheet
1Pages

TECH TOOLS Swing-DUO™ Software When used with our exclusive Swing CathodeTM , Swing-DUOTM (Dynamic Uniformity Optimization) software simulates the combined cathode array uniformity to produce individually optimized magnetic bar motion profiles.* Simulated Four Cathode Swing Array Optimization Results User friendly with a web-based interface, the software quickly designs coater configurations for optimal deposition uniformity. Swing-DUO™ makes uniformity compensation for systemic issues in the form of motion profile changes. The software prevents uniformity drift over the life of the target by creating multiple CAM tables for different target diameters •• •• •• •• •• Dwell-based simulation finds the key deposition angles and calculates the amount of time required at each angle. Optimizes uniformity for constant power or variable power Refines uniformity optimization using actual measured uniformity results Outputs a CAM table in angle and time format for simplified servo programming Indicates the amount of wasted material not deposited on the substrate as a function of the motion profiles The software opens from the Sputtering Components website for registered users. Visit the Sputtering Components website for a demonstration video. *Used for setup only. Final adjustments are process specific. 375 Alexander Drive, Owatonna, MN USA • 507-455-9140 sales@sputteringcomponents.com • www