EDA 3D Analysis Suite
2Pages

Product Highlights .. Component for rapid implementation of 3D analysis and visualization .. Robust 3D modeling for both simple and complex forms .. Flexible meshing tools for a wide range of solver applications .. Advanced visualization for complex multi-layer designs .. Object oriented C++ software toolkit DATA SHEET www.spatial.com Product Overview The EDA 3D Analysis Suite enables rapid development of 3D analysis and visualization features within current EDA physical design fl ows. The software component suite provides unique productivity and time-to-market (TTM) advances to tool developers, including 3D model creation from industry standard design data, interrogation, meshing, and visualization that brings signifi cant advantages to all aspects of electronic design—on-chip, packaging, and PCB. This extensible 3D technology is readily integrated into applications via a set of robust APIs to enhance 3D functionality of existing EDA tools to form the basis of entirely new applications that serve emerging markets. Integrating with your application the EDA 3D Analysis Suite provides all the preprocessing and visualization necessary to link your 2D application to your 2.5D and/ or 3D proprietary solver capability (Figure 1). The suite consists of a 3D modeler, a mesher subsystem that includes utilities to implement adaptive meshing, and a graphics display that is integrated and accessible through a unifi ed API to streamline developer learning curves and accelerate development time. ACIS Inside The fully functional modeler supplied within the suite enables creation of 3D models via data read from your application’s IC layout and technology fi le information, or package and PCB layout. The modeler supports the following classes of EDA applications: RF Design and Analysis .. On-chip embedded passive components .. Full 3D modeling for simulationbased extraction Parasitic Extraction .. Victim – Aggressor analysis Cell Design .. Characterization of 3D eff ects for thermal and signal integrity modeling .. Manufacturing variations (modeling CMP, etch, diff usion variations) System-in-Package .. Multi-chip-module .. Multi-die packages .. Die-to-Package and package-toboard 3D modeling Stacked Die (Through Silicon Vias) .. Complex multi-layer 3D modeling .. Non-rectilinear shapes .. High capacity TCAD .. Device level modeling and meshing .. Interconnect modeling .. Complex physical profi les Meshing The EDA 3D Analysis Suite off ers both pre and post-processing for 2D and 3D solvers: .. Advanced meshing capabilities integrated with the 3D model .. 2D surface and 3D volumetric meshing .. Automatic meshing with a rich set of refi nement options .. Support for anisotropic elements .. Adaptive meshing utilities The Mesher Subsystem Includes: Surface Meshing .. Triangular elements .. Quadratic elements Volumetric Meshing .. Tetrahedral elements Meshing Controls .. Anisotropic .. Mapped (geometrically regular) .. Adaptive Advanced Graphics The resulting 3D models are visualized using a high-performance, multiplatform graphics engine. The state-ofthe- art visualization engine provides extreme capacity and advanced features like colors, shading, textures, refl ectivity, and adjustable cutting planes. EDA 3D Analysis Suite

www.spatial.com Plug and Play The advanced functionality off ered by the EDA 3D Analysis Suite is delivered as a set of C++ libraries that are easy to add to any new or existing application. Key Benefi ts .. Time-to-Market – Rapidly implement complex 3D IC and system applications .. Innovation – Deploy new 3D applications to gain fi rst-to-market advantage .. Conserve Costs – Standardize core 3D technology across multiple applications .. Manage Resources – Maintain focus on your high value, diff erentiating design and analysis technologies DATA SHEET - EDA 3D Analysis Suite U.S. Corporate...