Sony’s CMOS image Sensor for Automotive IMX324 1/1.7-type 7.42megapixels CMOS image sensor Product Features • 1/1.7-type back-illuminated stacked CMOS image sensor with a RCCC pixel array • Unit cell size : 2.25pm • Number of recommended recording pixels: 3840(H) x 1920(V) approx. 7.37M pixel • Maximum frame rate in full pixel reading: 40 frame /s • High dynamic range (HDR) function with 120dB (EMVA1288 standard) • Variable-speed shutter function • Pixel binning mode, equipped with a unique function which switches pixel binning mode and full pixel mode for each frame alternately • MIPI CSI-2 serial data output (4 lane/2 lane) • Temperature sensor • Support security feature for automotive • ISO26262/ASIL B(D) • AEC-Q100 Grade 2 1. The industry's highest resolution*1 7.42 megapixels, enabling high-definition image capture of distant objects or wider field. 2. High sensitivity of 2666 mV with a pixel binning mode. Captures dark sections at high-sensitivity settings as well as bright sections at high resolution alternately. 3. Industry's first*1 automotive grade stacked image sensor that delivers both a compact size and low power consumption. 4. Industry's first*1 image sensor equipped with a security feature for automotive. This sensor Is expected to be compatible with the "EyeQ®4" and "EyeQ®5"*2 image processors currently being developed by Mobileye, an Intel Company headquartered in Israel, for use in ADAS and autonomous vehicle technology. *1 According to Sony research as of October 2017. *2 Registered trademark of Mobileye