SP3T SOI Antenna Switch for Diversity CXA2973GC Description CXA2973GC is a low power SP3T antenna switch for diversity switching applications. CXA2973GC has a 1.8V CMOS compatible decoder. The SONY Silicon On Insulator (SOI) technology is used for low insertion loss. Features ◆Low Insertion loss : 0.25dB(typ.) @800MHz 0.33dB(typ.) @2GHz 0.40dB(typ.) @2.7GHz ◆No DC Blocking Capacitors (except sourcing DC bias) ◆Solder Bump Bare Die(SBBD) : Bump Pitch=0.4mm ◆Small Flip-Chip Size : 1.1mm x 1.1mm x 0.35mm Typ. ◆Lead-Free and RoHS compliant ◆Applications: GSM Rx, 3G/LTE diversity Antenna Switch Structure SOI CMOS MMIC This IC is ESD sensitive device. Special handling precautions are required

Block Diagram Truth Table State State

Absolute Maximum Ratings ◆ Supply voltage ◆ Maximum input ◆ Operating temperature

Electrical Characteristics 1 (VDD=2.65V, Ta=25℃) Param eter Insertion Loss All ports in active paths 3fo Inter Modulation Distortion in Rx Band Control Current Supply Current Active Mode freq = 704 to 960 MHz freq = 1710 to 1990 MHz freq = 2110 to 2170 MHz freq = 2500 to 2690 MHz Pin = 26dBm, freq = 824 to 915 MHz Pin = 26dBm, freq = 1710 to 1910 MHz Pin = 26dBm, freq = 1920 to 1980 MHz Pin = 26dBm, freq = 2500 to 2570 MHz Pin on RF: 10dBm, 835MHz, Pin on ANT: -15dBm, 45MHz Pin on RF: 10dBm, 1745MHz, Pin on ANT: -15dBm, 95MHz Pin on RF: 10dBm, 1880MHz, Pin on ANT: -15dBm, 80MHz Pin on RF: 10dBm,...

Electrical Characteristics 2 (VDD=2.65V, Ta=25℃) Param eter Active Path Electrical Characteristics are measured with all RF ports terminated in 50 Ohms. *1 *2 *3 *4 freq = 704 to 960 MHz freq = 1427 to 1990 MHz freq = 2110 to 2170 MHz freq = 2500 to 2690 MHz

Electrical Characteristics 3 (VDD=2.65V, Ta=25℃) Param eter Insertion Loss Active Path Electrical Characteristics are measured with all RF ports terminated in 50 Ohms. * 18 freq = 207.5 to 222 MHz * 19 freq = 470 to 770 MHz

Recommended Circuit *1: No DC blocking capacitors are required on all RF ports. *2: DC levels of all RF ports are GND. *3: L1 (27nH) and C1 (12pF) are recommended on Ant port for ESD protection. *4: C2(100pF) is recommended on VDD pin for Decoupling Capacitor.

Solder Bump Foot Print (Macro) *Reference Device specification •Device size : 1.1mm × 1.1mm × t 0.350mm •Pin counts : 9Pin •Solder Bump height : 0.150mm •Solder Bump ball size : φ0.2mm •Solder Bump pitch : 0.4mm Detail - A •Land size (Resist Open area) : φ200um •Cu pattern size : (φ300um) : Resist open : Solder print area (Metal mask thickness : 110um) Device Area Via Metal Pattern

QM WIDTH EMBOSSED TAPING N0Tf)l. THE R HEASUBEHEHT If I TROUT INDICATION IS ASSDHED TO BE 0. 3n HA!, GEHERAL TOLERANCE: 10, 2 3. THE FEED HOLE ClNllLATlT( PITCH ERROR IS ASSlNEB AT±0. 2n/ I C PITCH. UNIMl

1) TYPE ND. t Ml 1 CHflRftCTERS ) IN SECTION C._ t FOR MORE THAN 2 CHARACTERS FOLLOW RULES FOR ABBREVIATIONS. I 2) MANUFACTURING YEAR ( f CHARACTER } IN SECTION B._ 3) SERIAL CODE ( MAX 3 CHARACTERS ) IN SECTION E.

Moisture Sensitivity Moisture Sensitivity Level for this part is MSL = 1 Note: The MSL of this product contains the following storage conditions (Taping). Storage period (With or without opening moisture-proof packing) ⇒The storage time limit shall be 1 year or less under storage environment conditions of temperature 30℃ or less and humidity 85RH or less. *This device is unnecessary management of moisture sensitivity. However, we will assume 1 year for the convenience of seal strength of the taping product. Avoid storage in locations exposed to direct sunlight, locations where corrosive gases...

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