
Description Features The ICX418AKL is an interline CCD solid-stateimage sensor suitable for NTSC color video cameras with a diagonal 8mm (Type 1/2) system. Compared with the current product ICX038DNA, basic characteristics such as sensitivity, smear, dynamic range and S/N are improved drastically.This chip features a field period readout system andan electronic shutter with variable charge-storage time. This chip is compatible with the pins of the ICX038DNA and has the same drive conditions. High sensitivity (+6.0dB compared with the ICX038DNA) 20 pin DIP (Cer-DIP) ? Low smear (Ֆ5.0dB compared with the ICX038DNA) ? High D range (+2.0dB compared with the ICX038DNA) ? High S/N ? High resolution and low dark current ? Excellent antiblooming characteristics Optical black position(Top View) ? Ye, Cy, Mg, and G complementary color mosaic filters on chip ? Continuous variable-speed shutter ? Substrate bias:Adjustment free (external adjustment also possible with 6 to 14V) ? Reset gate pulse:5Vp-p adjustment free (drive also possible with 0 to 9V) > Pin 1 ? Horizontal register:5V drive > 2 Device Structure? Interline CCD image sensor ? Optical size:Diagonal 8mm (Type 1/2) > 12VH ? Number of effective pixels:768 (H) 494 (V) approx. 380K pixels > 403 ? Total number of pixels:811 (H) ח 508 (V) approx. 410K pixels > Pin 11 ? Chip size:7.40mm (H) 5.95mm (V) ? Unit cell size:8.4m (H) 9.8m (V) ? Optical black:Horizontal (H) direction:Front 3 pixels, rear 40 pixelsVertical (V) direction:Front 12 pixels, rear 2 pixels ? Number of dummy bits:Horizontal 22Vertical 1 (even fields only) ? Substrate material:Silicon 1 ֖ > E01503B41Sony reserves the right to change products and specifications without prior notice. This information does not convey any license byany implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating theoperation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. size="-1">
Open the catalog to page 1ICX418AKL USE RESTRICTION NOTICE (December 1, 2003 ver.) This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the CCDproducts ("Products") set forth in this specifications book. Sony Corporation ("Sony") may, at any time, modifythis Notice which will be available to you in the latest specifications book for the Products. You should abide bythe latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor....
Open the catalog to page 21 2 φ φ RG NCV NCGND GNDRD NCH φ H DSUB >
Open the catalog to page 3∗ > ICX418AKL Absolute Maximum Ratings ItemSubstrate clock RatingsUnitRemarks φ > SUB GNDSupply voltageClock input voltageVoltage difference between vertical clock input pinsVoltage difference between horizontal clock input pins H V > DD , V > RD , V > DSUB , V > OUT ֖ GNDV > DD , V > RD , V > DSUB , V > OUT ֏ > SUB V Ə > 1 , V Ə > 2 , V Ə > 3 , V Ə > 4 Ɩ GNDV φ > 1 , V φ > 2 , V φ > 3 , V φ > 4 ֏ > SUB Ə > 1 1 , H Ə > 2 Ɩ V φ > 4 φ > RG GND ֏ > RG Ɩ φ > SUB V > L ֏ > SUB Pins other than GND and Ə > SUB Ɩ V > L Storage temperatureOperating temperature 0.3 to +50֖0.3 to +1855 to +10 ֖15 to +20...
Open the catalog to page 4ICX418AKL (3) Horizontal transfer clock waveform (4) Reset gate clock waveform > trtwhtf90%10%twlV φ H V HL V RGH Point AtwlV φ RG RG waveformV V RGL + 0.5V V RGLH V RGL RGLL V RGLm H φ 1 waveform twhtrtf +2.5V V > RGLH is the maximum value and V > RGLL is the minimum value of the coupling waveform during the period fromPoint A in the above diagram until the rising edge of RG. In addition, V > RGL is the average value of V > RGLH andV > RGLL .V > RGL = (V > RGLH + V > RGLL )/2Assuming V > RGH is the minimum value during the period twh, then:V φ > RG = V > RGH V > RGL Negative overshoot level...
Open the catalog to page 9ICX418AKL Definition of standard imaging conditions 1)Standard imaging condition I :Use a pattern box (luminance 706cd/m > 2 , color temperature of 3200K halogen source) as a subject. (Patternfor evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter andimage at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standardsensitivity testing luminous intensity.2)Standard imaging condition II :Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.Use a testing...
Open the catalog to page 13ICX418AKL 7.Dark signal shadingAfter measuring 6, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the dark signal output and substitute the values into the following formula. ∆ Ydt = Ydmax Ydmin [mV]8.Flicker1) FySet to standard imaging condition II . Adjust the luminous intensity so that the average value of the Y signaloutput is 200mV, and then measure the difference in the signal level between fields ( ֢Ȇ Yf [mV]). Thensubstitute the value into the following formula.Fy = ( ∆ Yf/200) 100 [%]2) Fcr, FcbSet to standard imaging condition II . Adjust the luminous intensity so...
Open the catalog to page 14ICX418AKL Spectral Sensitivity Characteristics (Excludes lens characteristics and light source characteristics) > 1.00.80.60.40.20400450500 CyYe MgG 550Wave Length [nm] Relative Response 600650700 Sensor Readout Clock Timing Chart > 2.52.52.52.533.5 1.6 0.2 Unit: s Odd Field Even Field V1V2V3V4V1V2V3V4 Ֆ 17 >
Open the catalog to page 1739NLower ceramicUpper ceramic 29N 29N 0.9Nm Low meltingpoint glass Compressive strength Shearing strength Tensile strength Torsional strength >
Open the catalog to page 20ICX418AKL c)The adhesive may cause the marking on the rear surface to disappear, especially in case the regulatedvoltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution.d)The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not toperform the following actions as this may cause cracks. ? Applying repeated bending stress to the outer leads. ? Heating the outer leads for an extended period with a soldering iron. ? Rapidly...
Open the catalog to page 212 Pages
2 Pages
2 Pages
2 Pages
2 Pages
6 Pages
5 Pages
16 Pages
17 Pages
24 Pages
17 Pages
5 Pages
21 Pages
11 Pages
5 Pages
24 Pages
11 Pages
12 Pages
29 Pages
22 Pages
22 Pages
15 Pages
23 Pages
14 Pages
14 Pages
15 Pages
11 Pages
5 Pages
15 Pages
17 Pages
17 Pages
13 Pages
17 Pages
14 Pages
13 Pages
13 Pages
20 Pages
68 Pages
23 Pages
13 Pages
6 Pages
11 Pages
2 Pages
2 Pages
2 Pages
5 Pages
2 Pages
2 Pages
2 Pages
2 Pages
34 Pages
30 Pages
2 Pages
2 Pages
2 Pages
2 Pages
2 Pages
2 Pages
2 Pages
2 Pages
2 Pages
2 Pages
2 Pages
17 Pages
18 Pages
18 Pages