LOW FLOW COLD PLATES - Solid State Cooling Systems - PDF Catalogs | Technical Documentation

Catalog excerpts

LOW FLOW COLD PLATE THERMAL RESISTANCE, EACH SIDE HEAT TRANSFER FLUID: 50/50 WEG Fluid Flow Rate (gpm) Low thermal resistance; designed for < 1 gpm coolant flow Ideal for use with thermoelectric modules, power semiconductors and laboratory hot/cold plates. Patented design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire surface means no hot spots. Double-sided: both sides have the same heat transfer properties. Thermal resistance graphs are shown for one side only; all values are reduced by approximately one-half for two-sided operation. Drill and tap through the outer 0.45" on both sides for easy parts mounting. Interior may be nickel coated. Length Standard lengths: 6” or 12” (15 or 30.5 cm) custom lengths available Flatness Flat to 0.0005 in./in. 0.005 in. overall (both sides) Weight Approximately 0.35 lbs per inch length Standard Fittings 1/8” FNPT SSCOOLING.COM (845) 296-1300 167 MYERS CORNERS RD. Solid State Temperature Control... Precisely.

Open the catalog to page 1

All Solid State Cooling Systems catalogs and technical brochures