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Volta Series

Volta Series
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Volta Series Probe Head Volta Series Probe Specifications Volta 180 Series Probe Head Wafer Level Testing Volta Series Specifications Minimum Probe Depth (At Test) Probe Travel ■ Kansas City, KS +1 913 342 5544 info.us@smithsinterconnect.com■ ■ Kirkland, QC, Canada +1 514 842 5179 info.us@smithsinterconnect.com Wafer Side music wire music wire music wire stainless steel stainless steel stainless steel Spring Material Device Side Contact Material Spring Force Contact Resistance ■ Genova, Italy +39 0 10 60361 info.it@smithsinterconnect.com■ Continuous Current Carrying Capacity (Room Temp.) Insertion Loss (Pattern: R-S-R @ -1 dB) Loop Inductance Working Temperature Europe■ ■ Deggendorf, Germany +49 991 250 120 info.de@smithsinterconnect.com■ Max. Number of Test Sites Asia■ ■ Bangalore, India +91 080 4241 0529 info.in@smithsinterconnect.com ■ ■ Mianyang, China +86 816 231 5566 HSICSR@hf-smiths.com■ ■ Shanghai, China +86 21 2283 8008 info.asia@smithsinterconnect.com■ ■ Suzhou, China +86 512 6273 1188 info.asia@smithsinterconnect.com Sorted Die Test Feature (Alignment Plate and Manual Actuator) Individual Contact Replacement Smiths Interconnect’s Volta 180 Series Probe Head addresses the need for reduced test time and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD). The Volta 180 Series is capable of testing sorted die for engineering development or failure analysis. Volta 180 Series offers a high performance, cost-effective, easily maintainable alternative to cantilever and vertical probe card technologies. Smiths Interconnect’s high performance spring probe contacts are used in the Volta Series. Spring probes are individually replaceable in the field with minimal tooling and technical expertise. The state-of-the-art Volta Manual Actuator (Lid) design allows sorted die tests, at all sites, simultaneously. The unique lid design eliminates the possibility of die cracking even after repetitive testing. This feature enables probe card bring-ups prior to even wafer availability. Smiths Interconnect’s capabilities cover design validation, RF measurements and custom simulations, including Probe Card Analyzer (PCA) test capability in Outgoing Quality Assurance. Defined by the FEA [Total pin count at a defined area is the limit] Notes: * Suitable for engineering plastic and machined ceramic ** Suitable for engineering plastic only The Volta Series Probe Head ensures improved efficiency in high reliability WLP, WLCSP and KGD testing. Copyright© 2020 Smiths Interconnect | All rights reserved | Version 1.0 The information contained within this document is subject at all times to applicable Export Control regulations and legal requirements Features ■ ■ Proprietary engineered plastic and machined ceramic for improved planarity allowing increased site to site test parallelism■ ■ Customized footprint with component clearance close to Device Under Test (DUT)■ ■ Probe Head to PCB alignment by guide pins with optional fiducials■ ■ Lid design options including individual spring loaded device plunger and floating device guide■ ■ Easy maintenance and quick installation■ ■ Field repairable■ ■ Compatible to industry standard interva

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Value Proposition Probe Head Preload Deflection FEA Analysis Non-plated noble material spring probe contact World-class Technology Optimized contact force for low and stable contact resistance Higher compliance compared to traditional vertical, cobra or pyramid contact technologies Sorted die test capability for test development 1 Fan-out routing approximately 600 pins from 180/200µm Probe Card Analyzer (PCA) validation capability 3 Up to 6 layers of Signal I/Os using laser stacked micro via Suited for tri-temp test Replacement for cantilever and vertical probe card technologies Available...

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