Catalogs >
Smiths Interconnect >
Semiconductor Test market brochure

Semiconductor Test market brochure
20Pages

Add to favorites

Catalog excerpts

Semiconductor Test Connectivity Solutions

Open the catalog to page 1

About Smiths Interconnect We Offer Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave, optical and radio frequency products that connect, protect and control critical applications in the Defense and Aerospace, Communications and Industrial markets. Smiths Interconnect Semiconductor Test Connectivity Solutions Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability,...

Open the catalog to page 2

Defense & Aerospace Your partner of choice for innovative connectivity solutions Years Experience Technology Broad Range of Advanced Interconnect Technologies Smiths Interconnect is part of Smiths Group plc, a global leader in applying advanced technologies for markets in threat and contraband detection, energy, communications and engineered components. Smiths Group has a presence in more than 50 countries. Flexibility High Volume Product Platforms & Complete Tailored Solutions Service Global Reach with Local Support Smiths Interconnect Semiconductor Test Connectivity Solutions

Open the catalog to page 3

Technology Brands IDI World’s most comprehensive offering of spring probe based solutions, including: contacts, connectors, interposers, semiconductor test sockets, and ATE interfaces. Proven off-the-shelf and custom products deliver the best solution for the customer’s specific application. HYPERTAC Premium interconnect solutions for electrical and electronic applications requiring optimized quality, performance, and reliability. Hypertac connectors utilize the original high performance hyperboloid contact technology; ideal for harsh environments and safety critical applications. HSI Joint...

Open the catalog to page 4

Technology Brands REFLEX PHOTONICS Embedded transceivers and transmit/receive modules for advanced interconnect-based solutions. Targeting high data rate interconnects where ruggedness and radiation resistance are required for defense, space, commercial aerospace and industrial applications. RF LABS High performance microwave cable assemblies and coaxial components supporting high performance operations, application-specific premium interconnects for high durability and harsh environments. MILLITECH Specializing in the engineering, manufacturing, and testing of millimeter-wave components,...

Open the catalog to page 5

Area Array Test ■ ■ ■ Deep Learning High-speed Memory Analog RF Smiths Interconnect Semiconductor Test Connectivity Solutions Package on Package Test ■ ■ ■ Smart Phone CPU Wearable Technology NFC - Near Field

Open the catalog to page 6

Providing A Competitive Advantage Proliferation of data devices and the growth of cloud computing, artificial intelligence and big data is resulting in complex systems and new materials that require rigorous, efficient validation. Smiths Interconnect’s test sockets and probe card solutions ensure superior quality and reliability in the semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well...

Open the catalog to page 7

Area Array Test High Speed Performance Supporting high pin count and high-speed signal applications. Engineered to meet stringent single ended signal performance (GDDRX), high current carrying capacity and active crosstalk cancellation for testing of GPUs, CPUs and other high speed digital applications. Smiths Interconnect Semiconductor Test Connectivity Solutions High current carrying capacity and active crosstalk cancellation

Open the catalog to page 8

Area Array Test Standard Array Test Socket ■ ■ ■ ■ ■ ■ ■ Innovative design with a wide range of material options Proprietary engineered plastic body for larger size BGA / LGA test Precision alignment calculation Replaceable floating or fixed device alignment guide feature Z-axis tolerance stacking analysis FEA analysis Customization and design flexibility Galileo Test Socket ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Uncompressed (free) height of 0.40 mm Compliant range up to 35% of overall thickness For use with all popular package types: BGA, LGA, QFN No contact alignment or registration holes required in PCB...

Open the catalog to page 9

Package on Package Test Cutting-Edge Technology High-speed, low profile contact technology delivering enhanced performance and competitive edge in testing Package on Package (PoP) devices used in smart phone CPUs and wearable technology. Unique ability to accurately and simultaneously align both the upper and lower device pads increasing fault coverage and reducing cost of test. Smiths Interconnect Semiconductor Test Connectivity Solutions Increased fault coverage and reduced cost of test

Open the catalog to page 10

Package on Package Test Euclid PoP Test Socket ■ ■ ■ ■ ■ ■ ■ ■ ■ Memory-bearing, memory-less and manual sockets Advanced alignment features for both top and bottom devices Refined analysis tools ensure production-ready solutions Controlled impedance available Features optional coaxial interposer for memoryless test RF simulation used to validate signal integrity of interface 6 Gbps options available Tester or socket supplies memory function during test through topside attach features Solutions are valid in both manual and automated test environments Silmat® PoP Test Socket ■ ■ ■ ■ ■ ■ ■ ■ ■...

Open the catalog to page 11

Peripheral Package Test Out of the Box Performance Engineered solutions using vertical spring probe technology, which seamlessly align complex device requirements to deliver out of the box performance, with minimal cleaning and extended mechanical life. Smiths Interconnect Semiconductor Test Connectivity Solutions High production throughput and reduced down time

Open the catalog to page 12

Peripheral Package Test Celsius Peripheral IC Package Test Socket ■ ■ ■ ■ ■ ■ ■ Wiping action ensures good device contact with minimal board side scrub Requires minimal cleaning Patented technology Suited for tri-temp peripheral testing Resistance < 20 m Bandwidth > 10 GHz @ -1 dB Temperature rated: -50°C to 175°C Silmat® Peripheral IC Package Test Socket ■ ■ ■ ■ Electrically transparent contact Low, stable contact resistance High frequency bandwidth > 80 GHz Signal path length < 1 mm Standard Array Peripheral IC Package Test Socket ■ ■ ■ ■ ■ Innovative design with a wide range of material...

Open the catalog to page 13