Semiconductor Test Connectivity Solutions
Open the catalog to page 1About Smiths Interconnect We Offer Smiths Interconnect, a Molex company, is a leading provider of high reliability connectivity products and solutions serving segments of aerospace and defence, medical, semiconductor test and industrial markets. It designs and manufactures technically differentiated electronic components, as well as microwave, optical and radio frequency products and sub-systems that connect, protect and control critical applications. Semiconductor Test Connectivity Solutions Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications....
Open the catalog to page 2Defence & Aerospace Your partner of choice for cutting-edge connectivity solutions Technology Broad Range of Advanced Interconnect Technologies Flexibility High Volume Product Platforms & Complete Tailored Solutions Service Global Reach with Local Support Semiconductor Test Connectivity Solutions
Open the catalog to page 3Technology Brands PLASTRONICS A leading supplier of burn-in test socket solutions for all the latest packaged devices. With the most comprehensive QFN catalog in the world, in addition to a large portfolio of sockets for burn-in, HAST, failure analysis and other test requirements for Leaded, LGA and BGA devices. IDI World’s most comprehensive offering of spring probe based solutions, including: contacts, connectors, interposers, semiconductor test sockets, and ATE interfaces. Proven off-the-shelf and custom products deliver the best solution for the customer’s specific application. HYPERTAC Premium...
Open the catalog to page 4Technology Brands Fibre Optics & RF Components Semiconductor Test EMC Board-level components incorporating advanced resistive and signal distribution technologies for a broad range of frequency spectrum applications. Extensive portfolio of RF devices used to attenuate, level, or terminate signals available in a variety of packages and footprints. LORCH Innovative solutions for the electronics and communications industries. Ranging from high performance wireless and RF products to microminiature, cavity, discrete, waveguide, tunable, ceramic, and printed filters and integrated assemblies. REFLEX...
Open the catalog to page 5Industrial Communications Aerospace & Defence WirelessInfrastructure Our solutions help evolution to 5G, while maximising the use of existing infrastructure. Our components and optical transceivers help ensure reliability in mission critical wireless communications. ■ Distributed Antenna Systems Our relentless pursuit of innovative high performance connectivity solutions enables us to provide high density, high power handling, EMI/EMP protection, RF and high speed capabilities focused on the next generation of airframe applications. We offer multiple interconnect technologies able to withstand...
Open the catalog to page 6Defence We partner with our customers to design and manufacture products and solutions including connectors, cable assemblies, multi-function RF systems, SATCOM terminals and datalinks to achieve optimal system performance in the most demanding end-user environments. ■ Integrated Vehicle Systems ■ Intelligence, Surveillance, Reconnaissance (ISR) We create high quality connector and cable assemblies that deliver increased phase stability, decreased insertion loss, and design flexibility for long lasting performance in lab and production test environments. We engineer superior NASA and ESA-certified...
Open the catalog to page 7Area Array Test Package on Package Test ■ GPU ■ NFC - Near Field Communications 8^ Semiconductor Test Connectivity Solutions
Open the catalog to page 8Proliferation of data devices and the growth of cloud computing, artificial intelligence and big data is resulting in complex systems and new materials that require rigorous, efficient validation. Smiths Interconnect's test sockets and probe card solutions ensure superior quality and reliability in the semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well as high performance spring probe technology...
Open the catalog to page 9High current carrying capacity and active crosstalk isolation High Speed Performance Supporting high pin count and high-speed signal applications. Engineered to meet stringent single ended signal performance (GDDRX). High current carrying capacity and active crosstalk isolation for testing of GPUs, CPUs and other high speed digital applications. E Semiconductor Test Connectivity Solutions
Open the catalog to page 10Standard Array Test Socket ■ Innovative design with a wide range of material options ■ Proprietary engineered plastic body for larger size BGA / LGA test ■ Precision alignment calculation ■ Replaceable floating or fixed device alignment guide feature ■ Z-axis tolerance stacking analysis ■ Customisation and design flexibility ■ Uncompressed (free) height of 0.40 mm ■ Compliant range up to 35% of overall thickness ■ For use with all popular package types: BGA, LGA, QFN ■ No contact alignment or registration holes required in PCB ■ Board-to-Board, Board-to-Flex PCB, DUT-to-Flex PCB application uses...
Open the catalog to page 11Package on Package Test Cutting-Edge Technology High-speed, low profile contact technology delivering enhanced performance and competitive edge in testing Package on Package (PoP) devices used in smart phone CPUs and wearable technology. Unique ability to accurately and simultaneously align both the upper and lower device pads increasing fault coverage and reducing cost of test. Semiconductor Test Connectivity Solutions Increased fault coverage and reduced cost of test
Open the catalog to page 12Euclid PoP Test Socket ■ Memory-bearing, memory-less and manual sockets ■ Advanced alignment features for both top and bottom devices ■ Refined analysis tools ensure production-ready solutions ■ Controlled impedance available ■ Features optional coaxial interposer for memoryless test ■ RF simulation used to validate signal integrity of interface ■ 6 Gbps options available ■ Tester or socket supplies memory function during test through topside attach features ■ Solutions are valid in both manual and automated test environments Elastomeric Contact PoP Test Socket Electrically transparent contact...
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