R-Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits ■ Industry-proven design, In-house tooling, molding and machining with 100% automated assembly. ■ Extensive catalog of components, configurable options ■ H-Pin offers unmatched DC performance. The R-Series product line is an open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market, there is no need to purchase new burn-in boards. The open-top design allows for autoloading, and un-loading of the integrated circuit. The small socket footprint outline allows you to utilize the full resources available in the burn-In system for each burn-in board. Each socket uses the H-Pin contact technology providing wide RF performance capabilities and exceptional DC characteristics. The Q-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and low loss. These features contribute to lower the cost of tests. ™ Feature Options ■ Auto IC loading / un-loading compatible ■ High temperature materials for above 200  °C applications ■ Drop-in replacement for legacy products Series Type RE 5 mm to 9 mm package size range for QFN, LGA, and BGA R 10 mm to 14 mm package size range for QFN and LGA - 10 mm to 13 mm package size range for BGA - Drop in replacement for legacy designs RL 16 mm to 19 mm package size range for QFN

R-Series socket specifications Mechanical properties Electrical properties ■ Pitch: ≥0.35 mm ■ Package size: LGA: 2 mm to 19 mm BGA: 2 mm to 19 mm ■ Pin count: 200+ ■ Temperature: –55  to 260  ºC ºC ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 4 A Materials ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics R-Series socket dimensions 34 27 12.04 more > smithsinterconnect.com   Copyright© 2023 Smiths Interconnect | All rights reserved | Version 1.0 The information contained within this document is subject at all times to applicable Export Contr