QN-Series Accelerated life testing solution Burn-in sockets for high-reliability testing of next-generation IC packages Benefits ■ Industry proven design, in-house tooling, moulding and machining, with 100% automated assembly. ■ Extensive catalogue of components and configurable options Feature Options Smiths Interconnect has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC, and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version. ■ Available in 0.40 mm, 0.50 mm, 0.65 mm, 0.80 mm, and 1.00 mm pitches ■ Custom pitches down to 0.30 mm ■ Lidded and Open Top Sockets for ≤10 mm packages ■ Lidded Sockets for 10 mm to 16 mm packages ■ Center ground pin standard for all sockets ■ Optional copper heat slug available for high wattage devices ■ Sockets for over 80 different JEDEC standard footprints

QN-Series socket specifications Mechanical Properties: Mounting: Thru hole Socket operation: Clamshell lid; ZIF open Operating temperature: -55  to 150  °C °C Contact Force: 32 g Life Cycles: 5,000 mechanical cycles Plastic body: PPS Contact base metal: BeCu Contact plating: Au over Ni; NiB optional Center pin base metal: Brass; Cu optional Center pin plating: Au Springs, torsion/coil: Passivated S.S. Contact resistance: <50 mΩ Inductance: 3 nH Current rating: 0.5A with 30  rise, 1.0 A with 75  rise °C °C Volume resistivity: 1 × 1015 Ω-cm Insulation resistance: 220.5 kV/cm QN-Series socket dimensions...