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Q-Series H-Pin® Socket

Q-Series H-Pin® Socket
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Q-Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits ■ Industry-proven design, in-house tooling, moulding, and machining, with 100% automated assembly. ■ Extensive catalogue of components, configurable options ■ H-Pin offers unmatched DC performance. Feature options The Q-Series socket is available for mid to large package sizes. The Q-Series is a fully moulded socket body and lid designed to meet the rigours of a wide variety of accelerated life testing applications. The lid can be configured with or without a heatsink for precise thermal response and with the aid of design simulation air channels are optimized to maintain accurate temperature throughout testing. This socket also uses the H-Pin™ contact technology providing wide RF performance capabilities and exceptional DC characteristics. The Q-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and low loss. These features contribute to lower the cost of tests. Heat sink HAST venting features Integrated thermal control with heater and sensor Reverse seating plane Max component clearance under the DUT 2 or 3 plate systems High temperature materials for above

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Q-Series socket specifications Mechanical properties Electrical properties ■ Pitch: ≥0.35 mm ■ Package size: LGA: 12 mm to 32 mm BGA: 12 mm to 32 mm ■ Pin count: 2000+ ■ Temperature: –55 to 260 ºC ºC ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 4 A Materials ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics Q-Series socket dimensions Heat sink, heater and RTD, spring-loaded pusher more > smithsinterconnect.com   Copyright© 2023 Smiths Interconnect | All rights reserved | Version 1.0 The information contained within this document is subject...

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