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Group: SMITHS GROUP
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Catalog excerpts
![Planar X RF Filters - 1](https://img.directindustry.com/pdf/repository_di/7638/planar-x-rf-filters-1004988_1m.jpg)
PLANAR X RF FILTER SERIES Thin Film Bandpass RF Filters
Open the catalog to page 1![Planar X RF Filters - 2](https://img.directindustry.com/pdf/repository_di/7638/planar-x-rf-filters-1004988_2m.jpg)
THIN FILM BANDPASS RF FILTERS Best-in-class RF Filter solutions in the X, Ku and Ka Bands designed and tested to support various applications and markets. Planar X Series of standard bandpass filters provide system engineers with high performance, compact, light-weight solutions for critical RF filtering in X, Ku, and Ka bands. Planar X Series compliments Smiths Interconnect’s broad portfolio of RF/Microwave components with an off-theshelf product reducing the lead times of custom designs. Planar X Standard Bandpass filters leverage thin film process technology on various dielectric...
Open the catalog to page 2![Planar X RF Filters - 3](https://img.directindustry.com/pdf/repository_di/7638/planar-x-rf-filters-1004988_3m.jpg)
Technical Characteristics Filter Specifications Characteristic Impedance Operating Frequency High Side Rejection Size Environmental Operating Temperature Storage Temperature Moisture Sensitivity Level Mechanical Configuration Surface Mount Substrate Materials Conductor Material Thin Film Gold - 25 microns nominal Shielding Material Nickel Silver Quality Assurance Sample visual and mechanical inspection - 1.0 AQL per mechanical drawing requirements Periodic electrical inspection performed for commercial grade products High reliability tested products are available Packaging Standard...
Open the catalog to page 3![Planar X RF Filters - 4](https://img.directindustry.com/pdf/repository_di/7638/planar-x-rf-filters-1004988_4m.jpg)
Additional Test Capabilities Smiths Interconnect can provide a wide array of add-on test services to suit market and program needs. Below is a list of standard available test options. Please consult factory for individual program needs. Per MIL-PRF-55342 Outgassing (space level only) Thermal Shock Power Conditioning (space level only) Precap Visual Inspection Short Time Overload Solder Mounting Integrity High Temperature Exposure Bondable Mounting Integrity Moisture Resistance Wire Bonding Integrity Life Testing Resistance to Soldering Heat Marking Legibility Test Resistance to Bonding...
Open the catalog to page 4All Smiths Interconnect catalogs and technical brochures
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