M-Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits M-Series socket has long been the gold standard for reliability and out-of-the-box performance burn-in sockets. The high-quality components have been refined and enhanced over their lifetime for optimum performance and the highest quality. M-Series being one of the most mature products in the portfolio does not mean it lacks technology. In fact, quite the opposite, the M-Series offers all the same configurable features and highperformance H-Pin™ contact technology to exceed performance expectations of the most demanding applications. The M-Series has been trusted to deliver uncompromised performance generation after generation. The small outline footprint provides design flexibility and allows for high socket density on the burn-in board. ■ Industry-proven design, in-house tooling, molding, and machining, with 100% automated assembly. ■ Extensive catalog of components and configurable options ■ Proven track record of reducing the cost of test leveraging modular components, automated assembly, and short lead times. ■ Exceptional electrical performance provides wide RF bandwidth. Feature Options ■ Spring loaded plunger ■ Heat sink ■ HAST venting features ■ Integrated thermal control with heater and sensor ■ Reverse seating plane ■ Max component clearance under the DUT ■ 2 or 3 plate systems ■ High temperature materials for ab

M-Series socket specifications Mechanical properties Electrical properties ■ Pitch: ≥0.30 mm ■ Package size: LGA: 0.6 mm to 16 mm BGA: 0.6 mm to 16 mm ■ Pin count: 1200+ ■ Temperature: –55  to 260  ºC ºC ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 4 A Materials ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics M-Series socket dimensions Heat sink, heater, and RTD Spring-loaded plunger more > smithsinterconnect.com   Copyright© 2023 Smiths Interconnect | All rights reserved | Version 1.0 The information contained within this document is subject...