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Kelvin Probes for Peripheral and Array Devices

Kelvin Probes for Peripheral and Array Devices
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Kelvin Probes for Peripheral and Array Devices - 1

Kelvin Probes Kelvin Probes Solution Kelvin probes for Peripheral and Array Devices Technical Features Device contact pitch: 0.35mm pitch and above Operating Temperature Range: -55°C to 120°C Device packages: BGA, WLCSP, QFN Pin-to-pin tip distance is 0.07mm-0.14mm, depending on the pin used Insertions: >500,000 Innovative beveled offset tip allows for tighter centers, down to 0.25mm on the device pad Smiths Interconnect has developed an innovative and robust spring probe technology for Kelvin contact applications down to 0.35mm pitch. Our Kelvin probes leverage the same DNA and world class quality that Smiths Interconnect spring probes are globally recognized for in the semiconductor market. The product’s unique chisel tip provides reliable, stable contact resistance for applications where test performance is critical. Designed into Standard Array test sockets or Volta WLCSP probe heads, Kelvin probes provide a robust, low maintenance, long life test solution. For even longer life, Kelvin probes can be optimized with Smiths Interconnect’s proprietary homogenous alloy to deliver a high touchdown count HVM production solution. Benefits Suited for 0.35mm pitch and above applications Four-terminal measurement for low resistance power and analog test Ease of maintenance Excellent signal integrity Self-cleaning top plunger design Leveraging state-of-the-art manufacturing facility processes, Kelvin probes reach a pin-to-pin spacing of just 70µm, and a pin-to-PCB spacing of 250µm. The Kelvin line covers device pitches of 0.35mm and above. As industry requirements continuously evolve, Smiths Interconnect innovates Kelvin probe product line to ensure that it supports all new technology standards. (Full Matrix) (Full Matrix)

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Kelvin Probes for Peripheral and Array Devices - 2

Kelvin Probes 350µm Pitch Kelvin Probe P/N 851-1003350-H00 Specification Mechanical • Typical Application: BGA/WLCSP • Minimum Device Pitch: 0.35mm @array, 0.25mm @single-row • Force: 15.5gf @ 0.45mm Recommended Travel • Operating Temperature Range: -55°C to 120°C • Device Side Contact: 2-Point Crown Tip • PCB Side Contact: Conical Radius Tip Electrical* • Contact Resistance: < 100mΩ average • Current Carrying Capability: 1.3 A Plating • Device Side Plunger: Homogenous alloy • PCB Side Plunger: Gold plated • Barrel: Gold plated Inside • Spring: Gold plated 350µm Pitch Full Matrix Footprint...

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