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Group: SMITHS GROUP
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Catalog excerpts
![K Series H-Pin® Socket - 1](https://img.directindustry.com/pdf/repository_di/7638/k-series-h-pin-socket-1047110_1m.jpg)
K-Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits The K-Series socket is designed to apply flat even pressure on the DUT with a secondary lever once the lid has been closed. This is to ensure that the platen does not skid across the top of the device when closing the lid potentially marking the device. This is especially important for exposed die products, or automotive applications where appearance is part of the pass/fail acceptance criteria post test. The vertical lever actuation does not increase the overall socket footprint, allowing for the highest density of populated sites on the burn-in board and in some cases reduces the overall footprint compared to other clamshell lid sockets. Another added benefit of the K-Series lid is airflow through the socket due to the taller profile, allowing for larger air channels to help maintain accurate temperatures. This socket also uses the H-Pin contact technology providing wide RF performance capabilities and exceptional DC characteristics. The K-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and Low loss. These features contribute to lower the cost of tests. ■ Industry-proven design, in-house tooling, molding, and machining, with 100% automated assembly. ■ Extensive catalog of components, configurable options ■ Zero-marking lid actuation contributes to higher yields. ■ Market-leading electrical performance Vertical pressure platen Heat sink HAST venting features Integrated thermal control with heater and sensor Reverse seating plane Max component clearance under the DUT 2 or 3 plate systems High temperature materials for abo
Open the catalog to page 1![K Series H-Pin® Socket - 2](https://img.directindustry.com/pdf/repository_di/7638/k-series-h-pin-socket-1047110_2m.jpg)
K-Series socket specifications Mechanical properties Electrical properties ■ Pitch: ≥0.30 mm ■ Package size: LGA: 10 mm to 23 mm BGA: 12 mm to 23 mm ■ Pin count: 1500 ■ Temperature: –55 to 260 ºC ºC ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 3 A Materials ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics K-Series socket dimensions 51.27 Handle closed and engaged. Plunger is down, touching the package and the actuation handle locks the latch while the package is under load. Handle opened and not engaged. Plunger is in the up condition, not...
Open the catalog to page 2All Smiths Interconnect catalogs and technical brochures
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