bringing technology to life Custom Spring Probe Solutions

Spring Probe Technology Smiths Interconnect is the world leader in spring probe design and the industry’s expert in applying spring probes as interposer contacts. Spring probes are an enabling technology that fundamentally change the capabilities of the products in which they are incorporated. Low Profile, High Compliance Ratio Spring probe technology permits an exceptionally high compliance-to-length ratio. This allows Smiths Interconnect to design interposers as compact as 0.08” (2.00 mm), while maintaining 0.02” (0.50 mm) of compliance. Accommodates Target Misalignment Spring probes are compliant...

Spring Probe Interposers Features and Benefits Utilizes low profile, high density spring probe technology ■■ Low, stable contact resistance throughout long insertion life ■■ Optimal signal integrity ≥ 40 GHz ■■ Accommodates reduced package size or footprint ■■ Advanced biasing techniques for RF power handling and elevated current carrying capacity ■■ High compliance with 1:3 travel to length ratio ■■ Reliable performance under conditions of heavy shock and vibration without contact interruption ■■ Renowned longevity in the field without sacrificing performance Interposers Smiths Interconnect...

Spring Probe Interposers Custom Interposer Features Alignment, Housing, Sealing & Termination Options Smiths Interconnect custom interposers are designed to ensure industry-leading reliability and performance with the flexibility to incorporate application-specific features. Through our unique design process, each interposer is specially developed using the following steps with guidance from our Field Applications Engineers and technical support teams. 1 spring probe meeting board spacing, pitch and electrical A requirements is selected from our broad portfolio (see pages 6-9). 2 he housing material...

Spring Probe Interposers Contact Terminations Smiths Interconnect offers termination options that are designed to amplify the unique advantages of our interposers. Surface Mount Smiths Interconnect surface mount interposers integrate easily with modern manufacturing processes. This style is soldered into place while still maintaining a low profile structure. Contact Terminations Compression Mount Smiths Interconnect compression mount solutions utilize spring probe compliance to ensure a reliable electro-mechanical connection. This solderless solution greatly simplifies the manufacturing process...

Spring Probe Interposers Interposer Probe Portfolio Dimensions and Specifications The following pages highlight Smiths Interconnect interposer probe portfolio. This information is intended as a reference for interposer design specification only as these probes are not available for individual purchase. Other designs may be available. Consult a Smiths Interconnect technical expert for more information. Probe Specifications Part Number Minimum Centers Current Rating 500033-000 0.039 (0.99) 3 A continuous (individual probe in free air at ambient temperature) Spring Force Typical Resistance Maximum...

bringing technology to life Spring Probe Interposers 500057 Probe Probe Specifications 500781 Probe Probe Specifications Dimensions are in inches (mm) | All specifications are subject to change without notice

Spring Probe Interposers smiths interconnect bringing technology to life Probe Specifications 500389 Probe Probe Specifications Dimensions are in inches (mm) | All specifications are subject to change without notice

Spring Probe Interposers Part Number Minimum Centers Current Rating 102197-000 0.040 (1.02) 6 A continuous (individual probe in free air at ambient temperature) Spring Force Typical Resistance Maximum Travel Working Travel Materials Barrel Spring Plunger & Post Nickel silver, gold plated Stainless steel, gold plated Beryllium copper, gold plated Performance Results Spring Probe Part Number 102197-000 The following performance results are reflective of spring probe part number 102197-000 housed in a 128-pin interposer. The tests were conducted with the bottom side of the interposer mounted against...

Spring Probe Interposers smiths interconnect bringing technology to life Initial Cycle 20G Sine Sweep X Axis Displacement vs. Frequency Testing was performed against Sinusoidal Vibration per EIA-364-28D, Test Condition IV, 20G peak level. The interposer was mounted between two PCBs which daisy chain the spring probe in series. Electrical continuity is monitored during vibration for any discontinuity greater than 1 ps under an electrical load condition of 100 mAmps maximum using a DM600-10 monitor. The sweep rate is 10 Hz to 2000 Hz at a rate of 20 minutes up and back. The sweep is repeated a...

Spring Probe Interposers Force Deflection Resistance Compression Force (g) Compression Resistance (mOhms) Current Carrying Capacity The current is increased by 1 Amp every 5 minutes until the probe reaches 80°C. The temperature rise is calculated (Probe Temp - Ambient Temp = T-Rise) and the curve is plotted. The current capacity is defined as the highest current before the probe reaches 80°C T-Rise. Extension Force (g) Extension Resistance (mOhms) Current Capacity Test Single Pin in Free Air Max T-Rise (°C) vs. Current (A) 80 70 60 Current carrying capacity is characterized in a chamber designed...

Spring Probe Interposers Near-End Crosstalk Differential RF performance was determined through simulation and optimization with HFSS software. The array shown (right) was utilized to determine the performance for this case. Probe arrays can be arranged in different configurations to achieve the desired performance. ■■ Near-End Cross Talk: > 50 dB ■■ Impedance: 102 Ω Insertion Loss Return Loss Rise Time Setting: 25 ps TDRZt (d1) Setup 1: Sweep RF Single-Ended Coax Model Insertion Loss Single-ended RF performance was determined through simulation and optimization using HFSS for the array shown...