HYPERSTAC SERIES STACKING SOLUTION FOR Z-AXIS INTERCONNECTIONS ESA qualified No soldering High contact density Compensation of surface contact tolerances HARSHEST ENVIRONMENTS The Smiths Connectors HyperStac Series is a Z axis interconnection solution for mezzanine packaging designed for all types of micro-electronics applications requiring reliable and compact packaging solutions: interconnection of MCMs (MultiChip Module) to PCBs, MCM to MCM, PCB stacking, etc. It meets the needs of the military electronic market (missile computers, fighter aircrafts, UAVs, Future Soldier equipment, etc), avionics (radars and digital control boxes, etc) and space market (launchers, satellites, space vehicles, etc). The HyperStac connector has already been used successfully in several space programmes such as the Pleiade observation satellites and the Inmarsat telecommunication satellites. In addition to its very compact size, 1.905mm pitch and contact height of 7.8mm, and its easy connection, the HyperStac ensures a full continuity of contact even in the harshest environments. The connector is fully ESA qualified after passing the most stringent of all tests which reproduces the maximal vibration conditions during take-off of rockets. The connector was successfully tested under 3-directional vibrations of 20g during 30 mns, without any nanocuts occurring. FLEXIBLE DESIGN Thanks to its adaptable geometry, the HyperStac connector can be adapted to any type of packaging: MCM, square, rectangular, and is also available in strips of different sizes (30 contacts or mor

TECHNOLOGIES RFF contact technology Smiths Connector’ Z-axis packaging solutions are required by a wide variey of electronic applications including: The key to the high performance of the HyperStac is the RFF contact. Module interconnections (MDC, ...) with PCB Module stacking (MCM, ...) PCB interconnections Interconnection between mother and daughter cards The original multipoint connection design is based upon a sliding 2 loop wire pin, held within a passive socket to allow for a solderless compression contact, applicable to multi chip modules. The compression spring enables a mechanical deflection...