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HDLP Catalogue

Product catalog summary

Overview: The HDLP Series by Smiths Interconnect features high-density, low-profile connectors utilizing Hypertac® hyperboloid contact technology. This technology is renowned for its reliability, low contact resistance, and ability to perform in harsh environments.

Key Features and Benefits:

Low Insertion/Extraction Forces: The design allows for controlled pin insertion and extraction, reducing the need for additional hardware.
High Density: Enables significant size and weight reductions in subsystem designs.
Long Contact Life: Capable of up to 100,000 insertion/extraction cycles with minimal performance degradation.
Low Cost of Ownership: Durable technology reduces the need for frequent replacements.
Lower Contact Resistance: Provides a greater contact area, reducing voltage drop and power consumption.
High Current Ratings: Design modifications allow for increased current capacity.
Shock and Vibration Immunity: The design ensures electrical continuity even under extreme conditions.
Reliability in Harsh Environments: Maintains electrical integrity under demanding conditions.

Technical Characteristics:

Mechanical: Contact diameter is 0.015 inches, with a life cycle of over 2,000 operations. Temperature range is -55°C to 125°C.
Electrical: Contact resistance is a maximum of 8 milliohms, with a current rating of 1 amp per contact and a voltage rating of 250 volts.
Materials: Insulator is made of liquid crystal polymer, contact material is copper alloy, and socket wire is beryllium copper.

Ordering Information: The document provides a detailed guide on how to order connectors, specifying options for alignment pips, insulator height/style, number of contacts, contact plating, gender, terminations, guides, and standard variations.

Dimensions and Configurations: Detailed dimensions for various connector configurations are provided, including single and double insulators, male and female connectors, and different termination styles.

Guide Hardware: Information on securing connectors to PCBs using guide hardware is included, with specifications for different styles and board thicknesses.

Contact Information: Global support contacts for sales and technical support across different regions and product categories are provided.

Catalog excerpts

HDLP Series High Density, Low Profile Connectors

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Hypertac® Hyperboloid Technology Smiths Interconnect offers an extensive range of superior contact technologies suitable for standard and custom solutions. Hypertac® (HYPERboloid conTACt) is the original superior performing hyperboloid contact technology designed for use in all applications and in harsh and demanding environments where high reliability and safety are critical. The inherent electrical and mechanical characteristics of the Hypertac hyperboloid contact ensures unrivalled performance in terms of reliability, number of mating cycles, low contact force and minimal contact resistance....

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HDLP Series Technical Characteristics Mechanical Contact diameter Contact life cycles Temperature range Extraction forces 1.0 oz. / 28.3 grams typical, per contact Material Insulator material Liquid crystal polymer (LCP) Contact material Copper alloy Socket wire material Beryllium copper Interfacial seal material Guides material Stainless steel Electrical Contact resistance Current rating Voltage rating 250 Volts, DC or AC, peak, at sea level Contact plating finishes Connector finish ordering code Component finish ordering code Plating thickness ASTM-B-488 Type II Grade C, Class 1 1.27 µm gold...

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HDLP Series 1 Connector family 2 Alignment pips Default is 2 if insulator style is 9 Default is 9 for 90° contact termination (90° female not currently available) Standard gold plating Through board solder - Straight PC Tail - 2.26 mm long 7 Contact terminations (Contact factory for more details) * Double height applies to Male connectors only Gold plate with tin dipped terminations (PC Tail only) Through board solder - Straight PC Tail - 3.16 mm long Through board solder - Straight PC Tail - 3.86 mm long Through board solder - 90° PC Tail - 2.26 mm long Through board solder - 90° PC Tail - 3.16...

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HDLP Series Insulators Male / straight Optional alignment pips Dimension A Dimension B Dimension C Dimension D Dimension E

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HDLP Series Insulators Female / straight Optional alignment pips No. of positions Dimension A Dimension B Dimension E

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HDLP Series Insulators Male connector, 90 degree (all dimensions are nominal unless stated)

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HDLP Series Contact terminations Male 90° PCB Termination style H J K

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HDLP Series Surface mount termination geometry Male connectors Femal connectors

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HDLP Series Circuit board preparation detail Surface mount Dimensions in mm, not to scale Sizes shown are recommended but not obligatory

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HDLP Series Circuit board preparation detail Straight PC tail Guide style Dimensions in mm, not to scale Sizes shown are recommended but not obligatory 9

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HDLP Series Circuit board preparation detail 90° PC tail Dimensions in mm, not to scale Sizes shown are recommended but not obligatory

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HDLP Series Guide hardware Connectors need to be secured to PCB to avoid stress on solder joints. This can be achieved using Hypertac guide hardware or any other suitable means. Male - guide pin style O* Board thickness Dimension A max Female - guide socket style L* Board thickness Dimension A max Male - polarising pin style H* Board thickness Dimension A max Female - polarising pin style F* Board thickness Dimension A max

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HDLP Series Guide hardware Male - fixing screw style J* Board thickness Dimension A max Female - fixing screw style J* Board thickness Dimension A max Male - fixed jacking post style DA & DB Board thickness Dimension A max Female - rotating jacking socket free connector style BA

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HDLP Series Guide hardware Female - locking socket styles B3 & B2 Male 90° - guide pin style P* Male 90° - locking post styles DL & DM Board thickness Board thickness

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Worldwide Support Connectors Semiconductor Test Technical Support Technical Support Technical Support Technical Support Technical Support Technical Support Fibre Optics & RF Components RF/MW Subsystems Americas, Europe & Asia Technical Support Technical Support [email protected] [email protected] [email protected] [email protected] [email protected] [email protected] [email protected] [email protected] [email protected]...

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HDLP Catalogue

HDLP Catalogue

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