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Galileo Test Socket
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Galileo Test Socket
1 /3Pages
Catalog excerpts
Galileo Test Socket Elastomeric Solutions for Digital High Speed & PoP Top Test
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Galileo Test Socket Galileo Test Socket Features & Benefits Patented, low profile contact As IC development timelines are increasingly compressed and accelerated, device bring up, characterization, and failure analysis activities must happen faster and faster. To support these requirements, Smiths Interconnect introduces the Galileo test socket architecture. - Solderless memory replacement - Short signal path - Conformal to recessed LGAs Galileo is an innovative, low-profile test socket engineered to support today’s high-performance Digital and RF applications. Using a unique “universal” elastomer...
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Galileo Test Socket Performance Electrical Properties # of Conductive Columns & Current Capacity By PCB & Device Pitch Continuous current (per lead*): 5.3A @ 20°c heat rise 8 Impedance: 0.080nH Rise Time Delay (TDT): 3 pieces (per 4mm x 4mm area) Thermal Resistance: 188.1K/W * Based on measured pad diameter of 0.28mm Current / Contact (Amps) Pulse current 1% duty cycle (per lead*): 5.3A @ 20°c heat rise Contact Resistance 25mΩ average BGA/LGA/QFN (per column, lumped resistance based on device pitch) Applications Bench Test Characterization Failure Analysis / RMA System Level Test Note: 1) Lab...
Open the catalog to page 3All Smiths Interconnect catalogs and technical brochures
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