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Smiths Interconnect
Galileo Test Socket

Galileo Test Socket

Product catalog summary

Galileo Test Socket Overview
The Galileo Test Socket is designed for high-performance digital and RF applications, offering a low-profile, solderless solution for memory replacement and high-speed signal integrity. It supports a wide range of package types and sizes, including BGA, LGA, QFN, and TQFP, with package pitches from 0.35mm to 1.27mm.

Technical Characteristics

Patented low-profile contact with short signal path and conformal to recessed LGAs.
High-frequency bandwidth exceeding 40GHz and low inductance for superior signal integrity.
Durability with no damage to PCB or solder balls, minimizing labor and downtime.
Engineering expertise includes Monte Carlo Analysis, Thermal Analysis, and RF Simulation.

Mechanical and Electrical Properties

Compliance/Travel: 0.1mm to 0.21mm, 35% of overall thickness.
Operating Temperature: -55°C to 125°C.
Force Range: 10g Min to 100g Max.
Capacitance: 0.075pF, Contact Resistance: <25mΩ, Current Capacity: 1.5A per column.
Bandwidth: -1.0dB at >40GHz.

Performance and Applications

Continuous current per lead: 5.3A at 20°C heat rise.
Pulse current 1% duty cycle per lead: 5.3A at 20°C heat rise.
Contact Resistance: 25mΩ average for BGA/LGA/QFN.
Insertion Loss (S21): 40GHz at -1dB, Impedance: 0.080nH.
Applications include bench testing, characterization, failure analysis, and system-level testing.

Key Benefits

Supports almost any standard package pinout without extra tooling charges.
Reusable across multiple pitches and pad/ball placements.
No contact alignment or registration holes required in the PCB, facilitating easy integration.
Ideal replacement for traditional spring probe-based interposers.

Catalog excerpts

Galileo Test Socket Elastomeric Solutions for Digital High Speed & PoP Top Test

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Galileo Test Socket Galileo Test Socket Features & Benefits Patented, low profile contact As IC development timelines are increasingly compressed and accelerated, device bring up, characterization, and failure analysis activities must happen faster and faster. To support these requirements, Smiths Interconnect introduces the Galileo test socket architecture. - Solderless memory replacement - Short signal path - Conformal to recessed LGAs Galileo is an innovative, low-profile test socket engineered to support today’s high-performance Digital and RF applications. Using a unique “universal” elastomer...

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Galileo Test Socket Performance Electrical Properties # of Conductive Columns & Current Capacity By PCB & Device Pitch Continuous current (per lead*): 5.3A @ 20°c heat rise 8 Impedance: 0.080nH Rise Time Delay (TDT): 3 pieces (per 4mm x 4mm area) Thermal Resistance: 188.1K/W * Based on measured pad diameter of 0.28mm Current / Contact (Amps) Pulse current 1% duty cycle (per lead*): 5.3A @ 20°c heat rise Contact Resistance 25mΩ average BGA/LGA/QFN (per column, lumped resistance based on device pitch) Applications Bench Test Characterization Failure Analysis / RMA System Level Test Note: 1) Lab...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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