Catalogs >
Smiths Interconnect >
ESJ Series H-Pin Socket

ESJ Series H-Pin Socket
2Pages

Catalog excerpts

ESJ-Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits ESJ-Series socket is a high-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The patented H-Pin contact technology in the ESJ-Series socket provides versatility and the ability to use the same socket for multiple application needs and test functions. Option for heatsink addresses the wide variety of product requirements targeted specifically for advanced mobile SoC, CPU, GPU, or other IoT application devices. When consistent reliability is required, ESJ Series is the product trusted in the industry. ■ Configurable design, in-house tooling, molding and machining provide short lead times. ■ Extensive catalog of components, drive reduction in cost of test. ■ Modular lid design allows for easy configuration of different end-use requirements. ■ Exceptional electrical performance provides wide RF bandwidth. Feature Options ■ Spring loaded plunger ■ Heat sink ■ HAST venting features ■ Integrated thermal control with heater and sensor ■ Reverse seating plane ■ Max component clearance under the DUT ■ High temperature materials for above

Open the catalog to page 1

ESJ Series socket specifications Mechanical properties Electrical properties ■ Pitch: ≥0.30 mm ■ Package size: LGA: 10 mm to 31 mm BGA: 10 mm to 31 mm ■ Pin count: 3000 ■ Temperature: –55 to 260 ºC ºC ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 4 A Materials ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics ESJ Series socket dimensions 75 Solder mask and back up plate (keep out zone) 69 Solder mask and back up plate (keep out zone) more > smithsinterconnect.com   Copyright© 2023 Smiths Interconnect | All rights reserved | Version 1.0 The...

Open the catalog to page 2