ES-Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits ES family Series of sockets extended the scope of a burn-in socket. The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled. Leveraging a variety of advanced manufacturing techniques and industry-leading automation enables the lowest cost of test. Our patented H-Pin technology provides versatility in the socket application which can be used for ATE and SLT functional testing, in addition to covering the full gambit of burn-in test applications. The ES family Series of sockets is designed for use with all advanced burn-in systems. With adaptation comes unmatched value in delivering cutting-edge technology. ES-Series product meets the demanding requirements of nextgeneration AI, datacenter, and network accelerator applications as these cutting-edge devices get larger and more powerful. The ES socket modularity allows for the platform to evolve with each new generation of device. ■ Configurable design, large tooling catalog, molding, machining, 3D printing, and assembly automation deliver best-in-class quality, price, and lead times. ■ An extensive catalog of standard components provides field-tested designs. ■ Double-latching clamshell provides ease of use during operation for high pin count applications. ■ Thermal and electrical simulation, Monte Carlo and FEA all ensure the delivery of out-of-the-box solution. Feature Options ■ Spring loaded plunger ■ Heat sink ■ HAST venting features ■ Integrated thermal control with heater and sensor ■ Reverse seating plane ■ Maximum component clearance under the DUT ■ High temperature materials for above

ES Series socket specifications Mechanical properties Electrical properties ■ Pitch: 0.40 mm minimum ■ Package size: LGA: 27 mm to 100 mm BGA: 27 mm to 100 mm ■ Pin count: 7000+ ■ Temperature: –55  to 260  ºC ºC ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 4 A Materials ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics ES Series socket dimensions Liquid cooled heatsink option Heat sink, heater and RTD, spring loaded pusher more > smithsinterconnect.com   Copyright© 2023 Smiths Interconnect | All rights reserved | Version 1.0 The information contained...