ES Micro Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors. ■ Configurable design, In-house tooling and molds allow for the lowest cost of test. ■ An extensive catalog of standard parts reduces cost and lead time. ■ Double-latching clamshell provides ease of use during operation and clearance for lid operation. ■ Exceptional electrical performance provides wide RF bandwidth. Feature Options ■ LGA, BGA, and package on package ■ Spring loaded plunger ■ Heat sink ■ HAST venting features ■ Integrated thermal control with heater and sensor ■ Reverse seating plane ■ Max component clearance under the DUT ■ High temperature materials for abov

ES Micro Series socket specifications Mechanical properties ■ Pitch: ≥0.30 mm ■ Package size for BGA: 4 mm to 22 mm ■ Pin count: 1190 ■ Temperature: –55  to 260  ºC ºC ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics Electrical properties ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 2.5 A ES Micro Series socket dimensions 5.97 Dimensions are in mm. Ø 5 vent hole Heat sink, heater, and RTD Spring-loaded plunger more > smithsinterconnect.com   Copyright© 2023 Smiths Interconnect | All rights reserved | Version 1.0 The information contained within...