smiths interconnect Enabling Reliable Testing at 224 Gbps with Unmatched Signal Integrity Performance

DaVinci Gen V Test Socket smiths interconnect DaVinci Gen V Test SocketEnabling Reliable Testing at 224 Gbps with Unmatched Signal Integrity Performance The DaVinci Gen V's ^ 5th-generation coaxi al design redefines high-speed testing. Its precision impedance tuning ensures flawless system matching The next generation of high-performance semiconductors—from advanced Consumer SoCs and GPUs to AI Accelerators and Data Center processors—demands unprecedented bandwidth and speed. Yet as data rates climb, ensuring signal integrity during testing becomes exponentially more difficult. Even slight impedance...

smiths interconnect DaVinci Gen V Test Socket IM Material Alignment Frame Spring Probes IM Material Cartridge Bottom ■ Solution for BGA, LGA and other variants ■ Spring probe technology using homogeneous alloy with gold plated for better grounding ■ Short signal path 4.90 mm test height ■ Impedance tuned to match system ■ Consistent stable contact resistance 55 mfi (Avg.) ■ Tri-Temp socket design to support -55 °C to +150 °C ■ Designed for manual test, bench test, and HVM production test using the same socket ■ New Manufacturing process to top and bottom cartridge ■ Design adaptation to meet...

DaVinci Gen V Test Socket smiths interconnect Technical Characteristics IMe Technology ■ DaVinci patented IM coating has been a fundamental technology component enabling exceptional performance for final test applications. ■ IM coating uses no dyes, it is the process of the coating adhering to the base material that creates the signature "gold" color of the product. ■ Our unique IM process provides exceptional electrical insulation and is key to our ability to impedance match the DUT system. ■ It provides exceptional robustness for socket housings, ensuring reliability in demanding production...