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D Series H-Pin® Socket

D Series H-Pin® Socket

D Series H-Pin® Socket

Product catalog summary
Benefits
  • Design flexibility with in-house tooling and molds for cost-effective testing.
  • Extensive catalog of components and configurable options.
  • Proven cost reduction in testing through modular components, automated assembly, and short lead times.
  • Exceptional electrical performance with wide RF bandwidth.
Feature Options
  • Compatible with QFN, QFP, LCC, SOIC, BGA, and LGA packages.
  • Includes spring-loaded plunger, heat sink, and HAST venting features.
  • Integrated thermal control with heater and sensor.
  • Reverse seating plane and high-temperature materials for applications above 200 °C.
D-Series Overview

The D-Series is a performance burn-in socket using H-Pin technology for high-reliability testing of next-generation IC packages. It features a clamshell-style lid that can be equipped with a heater and thermal sensor. The D-Series shares configurable features with other socket series in the Smiths Interconnect burn-in test portfolio, providing market-leading electrical performance for high-speed burn-in applications.

Specifications
  • Mechanical Properties: Pitch ≥0.30 mm, Package size for LGA: 2 mm to 25 mm, BGA: 2 mm to 20 mm, Pin count: 1570, Temperature range: –55 ºC to 260 ºC.
  • Electrical Properties: Contact resistance: 35 mΩ, Current carrying capacity: up to 4 A.
  • Materials: Contact: BeCu/Au plated, Spring: SS/Au plated, Socket: Engineering plastics.
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Catalog excerpts

D Series H-Pin® Socket-1

D-Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits D-Series Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor. The D-Series line shares the same configurable features as other socket series in the Smiths Interconnect burn-in test portfolio. Leveraging H-Pin™ technology the D-Series line provides market-leading electrical performance, for high-speed burn-in applications. ■ Design flexibility, in-house tooling and molds allow for the lowest cost of test. ■ Extensive catalog of components and configurable options ■ Proven track record of reducing the cost of test leveraging modular components, automated assembly, and short lead times. ■ Exceptional electrical performance providing wide RF bandwidth. Feature options ■ For QFN,QFP,LCC, SOIC, BGA, and LGA ■ Spring loaded plunger ■ Heat sink ■ HAST venting features ■ Integrated thermal control with heater and sensor. ■ Reverse seating plane ■ High temperature materials for abov

 Open the catalog to page 1
D Series H-Pin® Socket-2

D-Series socket specifications Mechanical properties Electrical properties ■ Pitch: ≥0.30 mm ■ Package size: LGA: 2 mm to 25 mm BGA: 2 mm to 20 mm ■ Pin count: 1570 ■ Temperature: –55  to 260  ºC ºC ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 4 A Materials ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics D-Series socket dimensions 41.66 more > smithsinterconnect.com   Copyright© 2023 Smiths Interconnect | All rights reserved | Version 1.0 The information contained within this document is subject at all times to applicable Export Contr

 Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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