High Frequency Wire Bondable Chip Terminations ALUMINUM NITRIDE, WIRE-BONDABLE, CHIP TERMINATION, DC-64 GHZ The CTX series of chip terminations pushes both the limits of frequency and power in a small easy to implement wire-bondable package. Smiths Interconnect’s new chip terminations offer a unique combination of high frequency and high power in a small package. The CTX high frequency termination series offers an unrivalled power rating capability up to 5 Watts, while reducing size and weight. The new CTX Series is designed to offer excellent broadband performance up to 64GHz. It allows wider coverage than traditional components while ensuring optimized return loss for multiple band ranges and applications. This allows the customer to use a single chip in multiple applications reducing the cost of ownership. The market trends of Space and Defense communications systems require higher frequency chip termination products specifically tuned to operate from L through V band frequency ranges where the power levels vary depending on the band of interest and whether the product functions on the transmit or receive part of the system. By providing a broader frequency range up to 64 GHz, we assure that the terminations with optimized return loss, are well suited for various bands of interest and a wide array of applications. Features and Benefits ■■ Power rating up to 5 Watts, increased by up to 5x over alternative solutions ■■ Frequency rating DC to 64 GHz with optimal broad band performance ■■ Excellent VSWR (1.25:1 Typical) ■■ Total Thin Film Construction ■■ Reduced footprint (up to 75% smaller) allowing for space and weight savings on the board: 0.040" x 0.040" x 0.015" ■■ High volume production capability supporting customers’ quick ramp up program needs Applications ■■ Amplifier Circuits ■■ Isolators ■■ Transmit/Receive Modules ■■ Up/Down Converters ■■ Instrumentation ■

Technical Characteristics Mounting Configuration Options Nominal Impedance Frequency Range Peak Power 10X CW power based on 1 µS pulse width @ 1% Duty Cycle 1.25:1 Typical Note: When properly matched in a 50 ohm system using Smiths Interconnect Suggested Mounting Guidelines. Environmental Operating Temperature Storage Temperature Temperature Coefficient Moisture Sensitivity Level Mechanical Substrate Material Aluminum Nitride Resistive Film Thin Film, Tantalum Nitride Terminal Material Thin Film, Gold over Nickel Ground Plane Thin Film, Solderable Silver over Platinum Protective Coating Silicon...

Power Derating Curve 100% RATED POWER SAFE OPERATING AREA Typical Data CT0404ALN1WB1 Series VSWR Mechanical CT0404ALNXWB1 - Wire Bondable INPUT Unless otherwise specified, tolerance: X.XXX = ±0.01” X.XXX =

Specify Model Number: CT0404ALNXWB1 W B 1 Wire Bondable

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