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smiths interconnect MICROWAVE COMPONENTS Line Catalogue

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About Smith Interconnect Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the Defence and Aerospace, Communications and Industrial markets. Our technology brands (EMC, Hypertac, IDI, Lorch, Millitech, Reflex Photonics, RF Labs, Sabritec, TECOM, TRAK and HSI) are synonymous with exceptional performance in technologically advanced, high quality solutions required for a high degree of safety and durability. Our extensive product portfolio...

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Technology Brands High Reliability RF/Microwave Resistive & Signal Distribution Components Board-level components incorporating advanced resistive and signal distribution technologies for a broad range of frequency spectrum applications. Extensive portfolio of RF devices used to attenuate, level, or terminate signals available in a variety of packages and footprints. Superior Performing Electrical Connectors for the Most Demanding Applications Premium interconnect solutions for electrical and electronic applications requiring optimised quality, performance, and reliability. Utilising the...

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High Frequency Microwave Cable Assemblies & Coaxial Components High performance microwave cable assemblies and coaxial components supporting high performance operations, application- specific premium interconnects for high durability and harsh environments. High Reliability Connectors for Commercial Aerospace & Railway Joint venture with Sichuan Huafeng Enterprise Group Co. Ltd, one of the major manufacturers of electronic components in China. Industryleading connectivity solutions for commercial aerospace and railway markets in mainland China.

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smiths interconnect

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Features • Frequency Ranges from DC to 50 GHz • Attenuation Values from 1 to 10 dB • Negative and Positive Temperature Coefficients of Attenuation (TCA) Available • Power Handling Up to 2 Watts • Space and Military Qualified • Surface Mount Packaging • Wire Bondable Connections Available • Impedance 50 and 75 Ohms • RoHS Compliant Option Available Benefits • Small Footprint • Zero Distortion • Totally Passive • Power Handling up to 2 Watts • Several Metallization Options Available • Tailored Response to Variations Over Temperature • Requires no DC power. The Thermopad® is a totally passive,...

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Loss of Gain Over Temperature Linear Compensation Thermopad Response • Small Footprint The Thermopad® is a totally passive absorptive microwave attenuator, which provides power dissipation that varies with temperature. The device can be used in any application that requires a known amount of attenuation change for a particular temperature shift. This is particularly useful for preventing gain loss over temperature in various amplifier applications. • Surface Mountable • Contributes No Signal Distortion • Totally Passive • Power Handling up to 2 Watts • Several Metallization and Packaging...

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General Specifications Part Numbering Code T V A SERIES TVA MTVA WTVA KTVA QTVA N T TCA SLOPE N = Negative P = Positive MOUNTING STYLE (blank) = Planar W3 = Triple Wrap W1 = Single Wrap WB1 = Wire Bondable Gold SMT = Surface Mount TCA fdB/dB/°Ci 03 = .003 through 09 = .009 in 1 dB steps ENVIRONMENTAL COMPLIANCE (blank) = Sn60Pb40 S = Pretinning G = Gold F = RoHS (Not available on WB1 or G) Note: Not every combination of attenuation and TCA values are available. Mounting Style Options Planar (no code) Planar device for flip chip mounting offers the best RF performance and lowest cost. Triple...

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General Specifications *TCA is temperature coefficient of attenuation and is calculated using the following equation: smiths interconnect

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EMC Technology’s TVA Thermopad®s are microwave absorptive attenuators which provide power dissipation that varies with temperature and operate in frequency ranges from DC to 6 GHz. This surface mount, temperature variable attenuator requires no bias or control voltages and generates zero distortion. This product is available with various metallization styles and plating options including gold for wire bonding applications, RoHS compliant lead free silver over nickel plating, 60/40 low temperature solder plating or 60/40 solder fused finish for easy reflow processing. It is available in both...

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Mini Thermopad® EMC Technology’s MTVA Thermopad®s are microwave absorptive attenuators which offer a smaller physical size with increased frequency range. The series operates DC to 18 GHz. The MTVA version of the Thermopad also offers wire bondable terminals for use with alternative high frequency attachment methods and space applications. This product is available with various metallization styles and plating options including RoHS compliant lead free silver over nickel plating, 60/40 low temperature solder plating or 60/40 solder fused finish for easy reflow processing MTVA Planar Series...

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WTVA Double Wrap Wire Bond Series WTVA (20.0 GHz) Wide Band Thermopad® The WTVA is EMC’s wide band temperature variable attenuator. This product provides a good linear shift from DC to 20 GHz and from -55°C to +125°C. EMC Technology’s Thermopads® are microwave absorptive attenuators which provide power dissipation that varies with temperature. They are used to correct gain variations in amplifiers and other active components which tend to have gain anomalies over temperature. The WB2 style uses thick film gold wire bondable terminals. The SMTF style is a RoHS compliant surface mount...

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KTVA (36.0 GHz) EMC Technology’s KTVA high frequency Thermopads® are ideal for millimeter-wave amplifiers. KTVA is capable of handling 100 milliwatts input power and available in wire bondable and surface mount packages. Standard narrowband versions cover specific segments in K and Ka bands. An optimized broadband version operating from 16 to 36 GHz is also available. KTVA design also offers custom frequency band responses for narrow band applications with improved VSWR performance and attenuation accuracy. This product is space qualified and has flight history for those requiring...

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